Comparison ledger
Plasma-Therm SLR 770 ICP Deep Silicon, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SLR 770 ICP Deep SiliconPlasma-Therm | 110Tegal |
|---|---|---|
| OEM | Plasma-Therm | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Plasma-Therm SLR 770 | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Load lock shuttle lock transfer[2] | — |
| Process Gas | O2, Ar, SF6, C4F6[2] | — |
| Chiller | Neslab HX300[2] | — |
| Power Box | Square D[2] | — |
| Manufacturer | Plasma-Therm[3] | — |
| Model | SLR 770[2] | — |
| Category | Etch[2] | — |
| Wafer sizes | 4 inch[2] | — |
| Tool type | Single-chamber inductively coupled plasma etcher[3] | — |
| Wafer handling | Load lock shuttle lock transfer[2] | — |
| Load lock | Single wafer semi-auto load lock[4] | — |
| Application | Deep silicon etch[4] | — |
| Gas box | Horiba SEC-E40 (4)[2] | — |
| Process gases | O2, Ar, SF6, C4F6[2] | — |
| Controller and RF generator | RF Power Products RFPP I22050001 & I20050007[2] | — |
| Adaptive pressure controller | VAT PM-5[2] | — |
| Heater controller | Plasmatherm PC OS[2] | — |
| RF generator | RF Power Products RFPP RF5S & AM-5[2] | — |
| Turbo pump and controller | Leybold MAG 2000; Leybold MD 2000[2] | — |
| Vintage | 01.06.1998[4] | — |
| Power | 1.0 kW ICP RF package; 2 kW generator limited to 1.0 kW; 500 W RF bias[4] | — |
| Gas box lines | 5 lines[4] | — |
| Additional process gases | CHF3, C4F8, SF6, Ar, O2[4] | — |
| Dry pump | Edwards ih80[4] | — |
| Load lock dry pump | Edwards nxds[4] | — |
| Load lock turbo pump | Leybold[4] | — |
| Turbo pump | Edwards STPA-1303CV[4] | — |
| Electrical | 380VAC 3 phase[4] | — |
| Wafer size | 4 inch[2] | — |
| Controller & RF generator | RF Power Products RFPP I22050001 & I20050007[2] | — |
| Turbo pump & controller | Leybold MAG 2000; Leybold MD 2000[2] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[5] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[5] |
| Physical description | — | compact[1] |
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