Waferpedia

Comparison ledger

CPX Pegasus versus RIE-10

SPTS CPX Pegasus and SPTS RIE-10, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
RIE-10SPTS
OEMSPTSSPTS
CategoryEtchEtch
Wafer size6-inch wafers
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilySPTS CPX PegasusSPTS RIE-10
Specifications
Configuration2 Chambers[1]
Frequency60Hz[1]
Source RF GeneratorMKS 6.5 kw RF Power Generator[1]
Platen RF GeneratorMKS/ENI ACG 3B 13.56MHz RF Generator[1]
Rotary Pump3 PCS[1]
Turbo pump2 PCS[1]
DI WaterSMC HRZ-L2-DY chiller[1]
Silicon oilSMC HRZL-D chiller[1]
Etch rate6–10 µm/min[2]
Aspect ratio50:1[2]
Selectivity to resist>50:1[2]
Selectivity to silicon oxide>100:1[2]
Uniformity<5% across 6-inch wafers[2]
Primary RF powerup to 3,000 W[2]
Secondary RF powerup to 3,000 W[2]
Substrate powerup to 300 W[2]
Chuck temperature range-15°C to +40°C[2]
Sample size handling6-inch or smaller samples[2]
End point detectorClaritas End Point Detector[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu