Comparison ledger
SPTS MACS ICP and SPTS Synapse, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | MACS ICPSPTS | SynapseSPTS |
|---|---|---|
| OEM | SPTS | SPTS |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SPTS MACS ICP | SPTS Synapse |
| Specifications | ||
| Configuration | HR chamber[1] | — |
| Clamp type | standard WTC[1] | Electrostatic clamping[2] |
| Coil RF power | Advanced Energy RFG3001, 3kw[1] | — |
| Platen RF power | ENI ACG-3B 13.56MHZ, 300w[1] | — |
| Load lock pump | Ebara AAL10[1] | — |
| Chamber pump | Ebara A30W[1] | — |
| Turbo pump | Leybold MAG2000CT[1] | — |
| Turbo Pump Controller | Leybold MAG Drive 2000[1] | — |
| Chiller | ATS/DEX-20ADI[1] | — |
| Plasma source | — | ICP-based high density plasma source[2] |
| Dedicated materials | — | Etching of SiO2 and SixNy layers[2] |
| Wafer handling | — | Loadlock/chamber transfers for single wafer processing[2] |
| Endpoint detection | — | Optical Emission Spectroscopy (EOS) and laser reflectometry/interferometry[2] |
| Gases available | — | O2, Ar, He, H2, SF6, C4F8, CF4, CHF3[2] |
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