Comparison ledger
STS Multiplex ICP Advanced Oxide, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 110Tegal | |
|---|---|---|
| OEM | STS | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | STS Multiplex ICP | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Voltage | 208 V[2] | — |
| Configuration | 80 A[2] | — |
| Frequency | 60 Hz[2] | — |
| RF Generators | ENI ACG10B 1kW (13.56MHz)[2] | — |
| Clamp Type | Standard WTC[2] | — |
| Platen Type | Domed[2] | — |
| Turbo Pump | None[2] | — |
| MACs Robot | None[2] | — |
| Pumping System | None[2] | — |
| Manufacturer | STS[2] | — |
| Model | Multiplex ICP[2] | — |
| Model name | Multiplex ICP Advanced Oxide Etcher (AOE)[2] | — |
| Wafer sizes | 6, 8 inch[2] | — |
| Electrical | 208 V - 80 A - 3 Ph - 60 Hz[2] | — |
| RF generator and matching unit | Coil RF generator and matching unit[2] | — |
| RF generator | ENI ACG10B 1kW (13.56MHz)[2] | — |
| Load lock | Carousel Vacuum Load lock[2] | — |
| Gas delivery | Gas box[3] | — |
| Gases | CHF3, CF4, SF6, O2[2] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[4] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[4] |
| Physical description | — | compact[1] |
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