STS
Multiplex ICP Advanced Oxide
The STS Multiplex ICP Advanced Oxide is a semi-auto carousel etcher for 6-inch to 8-inch wafers. The STS Multiplex ICP Advanced Oxide uses a 208 V electrical configuration. The STS Multiplex ICP Advanced Oxide includes an ENI ACG10B 1 kW RF generator at 13.56 MHz.[1][2]
What it is
The STS Multiplex ICP Advanced Oxide Etcher is a semiconductor etch system. The machine is a semi-automatic carousel tool for wafers in the 6-inch to 8-inch range.[1][2]
The STS Multiplex ICP family is a load-locked inductively coupled plasma etch system family. The Advanced Oxide variant belongs to that etch-tool class and uses a carousel wafer-handling arrangement.[3][2]
Where it fits in the process flow
General reference — not yet source-verifiedThe STS Multiplex ICP Advanced Oxide Etcher sits in the wafer etch portion of the process flow. The tool removes patterned material after lithographic masking and before later integration steps.
What do the numbers mean?
Power & electrical7
- Coil RF generator and matching unit[1]
Vacuum & pumping4
- Carousel Vacuum Load lock[1]
Wafer handling2
Gas & chemistry4
Configuration & options13
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Voltage208 V[1]
- Frequency60 Hz[1]
- ConfigurationCoil RF generator and matching unit[1]
- ConfigurationGas box[1]
- RF GeneratorsENI ACG10B 1kW (13.56MHz)[1]
- ConfigurationCarousel Vacuum Load lock[1]
- Turbo PumpNone[1]
- Pumping SystemNone[1]
- ConfigurationGases:[1]
- Electrical208 V - 80 A - 3 Ph - 60 Hz[1]
- RF generator and matching unitCoil RF generator and matching unit[1]
- RF generatorENI ACG10B 1kW (13.56MHz)[1]
- Load lockCarousel Vacuum Load lock[1]
- Gas deliveryGas box[2]
- GasesCHF3, CF4, SF6, O2[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Multiplex ICP Advanced Oxide are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Multiplex ICP Advanced Oxide are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Multiplex ICP Advanced Oxide are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Multiplex ICP Advanced Oxide are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Multiplex ICP Advanced Oxide are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Multiplex ICP Advanced Oxide is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]STS Multiplex ICP family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 13, 2026.
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