Waferpedia

Comparison ledger

ACS 300versusACS 300 Gen 2

SUSS MicroTec ACS 300, SUSS MicroTec ACS 300 Gen 2, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ACS 300SUSS MicroTec
ACS 300 Gen 2SUSS MicroTec
OEMSUSS MicroTecSUSS MicroTec
CategoryResist ProcessingThermal / Diffusion
Wafer size—300mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySUSS MicroTec ACS 300SUSS MicroTec ACS 300
Specifications
ConfigurationDeveloper (4)[1]Includes:[2]
Wafer size—System tooling for 200/300 mm semi spec wafer sizes[2]
OEM—SUSS MicroTec[3]
Model—ACS 300 Gen 2[4]
Equipment type—Coater / Developer[2]
Automation—fully automatic[3]
Architecture—modular[3]
Process modes—spin-coating and spray-coating[3]
Integrated functions—coat, bake, and develop modules[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org
  4. [4]Equipment inventory listing