ACS 300

The SUSS MicroTec ACS 300 is a resist processing tool in the spin coater and developer equipment class. Resist processing tools apply and develop photoresist on wafers as part of photolithography. Spin and spray systems in this class are used to form uniform resist films and to remove selected resist after exposure.

Resist processing systems of this class handle wafers through coating, bake, and developing operations associated with lithography. Spin coating dispenses liquid resist onto a rotating wafer so centrifugal flow spreads the material into a controlled film. Development then dissolves the portions of resist intended to be removed after exposure. Automated platforms in this class typically use enclosed process modules and wafer handling to support repeatable lithography preparation and pattern transfer steps.

Resist processing tools sit in the lithography sequence around exposure. Coating and edge preparation occur before the wafer enters an aligner or stepper. Development follows exposure to reveal the resist image that will guide later etch, plating, implantation, lift-off, or deposition patterning. Bake steps are commonly paired with these operations to stabilize the resist film and the developed pattern.

Resist processing equipment of this class is used where wafers need a patterned resist mask for later fabrication steps. Such tools support standard photoresist processes as well as thicker resist films and coatings over uneven surface topography. Spray methods in this class are used when conformal coverage over pronounced features is important.