Comparison ledger
SUSS MicroTec SD 12 Semi-Automatic Wet Processing, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SD 12 Semi-Automatic Wet ProcessingSUSS MicroTec | 1000PYES |
|---|---|---|
| OEM | SUSS MicroTec | YES |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | 150mm | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1998 Acquisition |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec SD 12 Semi-Automatic Wet Processing | YES 1000P |
| Specifications | ||
| Configuration | IPC With Touch Screen[1] | Parallel plate[3] |
| Operating System, | Microsoft Windows 10[1] | — |
| Speed | Up to 3.000 rpm (Depending on Substrate Size and Load)[1] | — |
| Acceleration | Programmable[1] | — |
| Spinning Time | 0.1 up to 999s[1] | — |
| OEM | SUSS[1] | — |
| Model | SD 12 Semi-Automatic Wet Processing[1] | 1000P[2] |
| Control interface | IPC with touch screen[1] | — |
| Process chamber | Stainless steel[1] | — |
| Dispense arm | Motorized[1] | — |
| Connection | Ethernet link[1] | — |
| Safety package | Solvent[1] | — |
| Back side rinse | Included[1] | — |
| Drying | Nitrogen drying[1] | — |
| Filter unit | Solvent filter unit[1] | — |
| Media storage | SS EX[1] | — |
| Solvent developer insert ring | R6-R8-BSR[1] | — |
| Power | 50/60 Hz, 3x400 VAC[1] | 1000 W[3] |
| Spinning time | 0.1 to 999 s[1] | — |
| CDA purge | Included for spin light tower[1] | — |
| Tool status display | Red, yellow, blue[1] | — |
| Vacuum chuck | R6 with exchangeable centering pins for 150 mm and 152 mm round SEMI standard wafers[1] | — |
| Pressure tank system | 10 L stainless steel tank with empty, low, full, and overfull sensors; quick connector for manual filling; pressure regulated with gauge; maximum pressure 2.5 bar[1] | — |
| Waste canister | 20 L stainless steel waste tank with full and overfull level sensor; spill pan with leakage sensor included[1] | — |
| Tape frame vacuum chuck | For 150 mm wafer[1] | — |
| Dispense system | FFKM dispense system 660 / Puddle & FANSPRAY[1] | — |
| Max Pressure | 2.5 bar[1] | — |
| Wafer size | For 150 mm Wafer FFKM[1] | — |
| System type | — | Plasma cleaning system[2] |
| Shelf configuration | — | Four 16 x 16 inch shelves[2] |
| Total capacity | — | 1024 square inches[2] |
| Control system | — | PLC driven with plain English real time process readout and diagnostics in the event of system abort[2] |
| Number of shelves | — | 4[2] |
| Shelf size | — | 16 x 16 inches[2] |
| Operation modes | — | Active, RIE, Downstream[2] |
| Sample size range | — | From smallest semiconductor chip to large flat panels[2] |
| Type | — | Plasma cleaning system[2] |
| Shelves | — | Four 16 x 16 inch shelves[2] |
| Control | — | PLC driven with plain English real time process readout and diagnostics in the event of system abort[2] |
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