Waferpedia

Comparison ledger

110versus1512e

Tegal 110, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
110Tegal
1512eTegal
OEMTegalTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTegal 110Tegal 1512e
Cited variants—
Specifications
model110 SE[1]—
application focusprocess development applications[1]—
process capabilitydeep silicon plasma etching[1]—
capabilitiesvery high aspect ratio trench etch and profile control[1]—
configurationmultiple configurations with minimum technical intervention[1]—
System typeplasma etch system[2]—
Supported componentsMEMS and 3D-IC components[1]—
Control capabilityvery high aspect ratio trench etch and profile control[2]—
Physical descriptioncompact[1]—
Tool type—Industrial RIE plasma etcher system[3]
Stated configuration—With modules assembly for CI-4222[3]
Category—Etch[4]
Condition—Used[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]waferpedia.comwaferpedia.com
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]waferpedia.comwaferpedia.com
  5. [5]semistarcorp.comsemistarcorp.com