Comparison ledger
Tegal 110, Ulvac NE 950 EX ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 110Tegal | NE 950 EX ICPUlvac |
|---|---|---|
| OEM | Tegal | Ulvac |
| Category | Etch | Etch |
| Wafer size | — | Wafer end effector |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 110 | Ulvac NE 950 |
| Cited variants |
| — |
| Specifications | ||
| model | 110 SE[1] | — |
| application focus | process development applications[1] | — |
| process capability | deep silicon plasma etching[1] | — |
| capabilities | very high aspect ratio trench etch and profile control[1] | — |
| configuration | multiple configurations with minimum technical intervention[1] | — |
| System type | plasma etch system[2] | — |
| Supported components | MEMS and 3D-IC components[1] | — |
| Control capability | very high aspect ratio trench etch and profile control[2] | — |
| Physical description | compact[1] | — |
| Configuration | — | Toshiba FA2-100SS computer[3] |
| Wafer size | — | Wafer end effector[3] |
| Make | — | Ulvac[3] |
| Model | — | NE 950 EX[3] |
| Process type | — | Inductively coupled plasma (ICP) etcher[3] |
| Control computer | — | Toshiba FA2-100SS computer with computer screen[3] |
| Vintage | — | 2015[3] |
| System modules | — | Loadlock & cassette stage module, cassette load, cassette aligner, carrier load/aligner, atmospheric robot with dual end effectors, carrier end effector, wafer end effector, transfer chamber[3] |
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