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Comparison ledger

211versus3303 Lift Off

TEGAL 211, Veeco 3303 Lift Off, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
211TEGAL
OEMTEGALVeeco
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTEGAL 211Veeco 33xx
Specifications
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1]—
Process TypePlasma Asher/Etcher[2]—
Wafer Size (max)3 inch[2]—
Form FactorTable top[2]—
Chamber MaterialAluminum[1]—
Chamber Internal Dimensions6 x 6 x 3.75 inches[1]—
Timer Range0-99 minutes[2]—
HPC solvent lift off process—500-2300 PSI1)[3]
Configuration—HVS (High Velocity Spray) Chamber up to 40 PSI[3]
Model—3303[3]
Machine type—Lift Off Machine[4]
Wafer size—6 inch[3]
Process—HPC solvent lift off process[3]
Process pressure—500-2300 PSI[3]
Chamber pressure—up to 40 PSI[4]
OEM—Veeco / SSEC[3]
HVS chamber pressure—up to 40 PSI[3]
Vintage—2006[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]dealer listingsemistarcorp.com
  2. [2]jmind.comjmind.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com