Tokyo Electron
TE 8401 Dry alternatives
Comparable Etch equipment documented in the Waferpedia catalog.
6 comparable tools
Lam Research
Alliance A 6 Exelan HP Dielectric
Etch
Lam Alliance A 6 Exelan HP Dielectric is an etch tool with an 8-inch wafer size.
Applied Materials
0010 47763
Etch
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
Applied Materials
0010-16392 ESC Assembly
Etch
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Applied Materials
0041-39086 ESC Part
Etch
Oxford Instruments
100 ICP Fluorine
Etch
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
Tegal
110
Etch
The Tegal 110 SE is a compact, flexible plasma etch system for process development applications, with deep silicon etching capabilities for MEMS and 3D-IC components.
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