Etch

The SPTS CET25 is a 25-wafer batch process module for HF vapor release etch for MEMS.

The Oxford NGP80 RIE is a plasma etch system located in room W1-062.

The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.

The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.

The Oxford Plasmalab 100 RIE is a reactive ion etching platform for dielectric etching, MEMS, and R&D applications.

The Applied Materials Centura I Phase II Oxide Etcher (also known as the 5200 Centura I Phase II) is an oxide etcher configured for 6-inch wafers with an upgrade path to 200 mm wafers.

The Applied Materials Centura TPCC RTP XE+ is an etcher designed for 8-inch wafers.

The Tokyo Electron Unity II E 855 SS is an etcher for 8-inch wafers.

The Lam Research 590 is a plasma etcher.

The Tel Unity II E 85 DD is an 8-inch oxide etch system.

The Lam Research TCP 9600 is a dry etch system for metal etching, designed for 200 mm wafers.

The Applied Materials CENG 2 is a dry etcher used in semiconductor manufacturing.

The Lam 2300 e 4 Exelan GX is an etcher used in semiconductor manufacturing.

The Tokyo Electron Tactras is a series of plasma etch systems for 300mm wafers, first launched in 2006.

The Lam/SEZ 201 Backside Etcher is a backside etching tool for 8-inch wafers.

The Lam / SEZ 203 is a spin processor used for wet etching and backside cleaning of 200mm wafers.

The Lam Research TCP 9400 SE is an inductively coupled plasma etch system used for polysilicon/polycide etch and shallow trench isolation.

The Lam Research 2300 Versys Kiyo Polysilicon Etch is a 300mm wafer plasma etch system designed for polysilicon etching.

The Lam Alliance A 6 TCP 9400 DFM is an 8-inch polysilicon etch system from Lam Research.

The Lam 2300 V 2 Versys Kiyo 45 is a 12-inch polysilicon etch system.

The SPTS / STS Multiplex ICP is a dry etcher manufactured by SPTS / STS.

The SPTS XeF2 is a highly selective isotropic etching system for Si, Mo, Ge, and W, with room-temperature operation and no plasma.

The Plasma Therm 720/740 is a dual-chamber RIE loadlocked system with chlorine- and fluorine-based chemistry.

The Plasma-Therm 770 SLR series is an inductively coupled plasma (ICP) etch system used for dry etching of materials such as silicon, SiO₂, Si₃N₄, and compound semiconductors.

The Telius SP Vesta is a dry etcher for 12-inch wafers manufactured by Tokyo Electron (TEL).

The STS Multiplex ICP is a load-locked inductively coupled plasma etch system used for deep silicon etching using the Bosch process.

Applied Materials Centura AP Enabler Dielectric Etcher is a 300 mm dielectric etcher with GEM/CIM JGJ online connection and a 3 carrier stage interface.

The Memsstar Orbis Alpha Oxide Etch System is a small-footprint, self-contained oxide etch system that uses hydrogen fluoride etchants.

The TEL Tokyo Electron Telius is a dry etcher for 300 mm wafers.

The Applied Materials Centura 5200 ES MxP Poly is an etch system that handles 8-inch wafers.

The PVA TePla 300 is a high-frequency plasma etch tool used for photoresist stripping, wafer surface cleaning, and hydrophilic surface enhancement.

The Oxford PlasmaPro 100 Cobra is an etcher with 8 inch wafer size, an ICP chamber with Cl2 and BCl3 capability, and three RIE chambers.

The Oxford 80 Plus RIE is a reactive ion etcher.

The Alcatel AMS 200 SE is a deep reactive ion etching system for silicon and silicon-on-insulator wafers.