Etch

The Tegal 901G is a diode plasma etcher specially configured for GaAs processing and used for etching high-performance devices on gallium arsenide substrates.

The Lam Research TCP 9400 ICP is an inductively coupled plasma etcher from Lam Research.

The Tel Unity M 8555 DDD is an etcher from Tokyo Electron.

Lam Research A 6 Exelan HPT is a dielectric etch tool configured for 8-inch wafers and identified with Exelan HPT chambers.

The Lam Research 2300 Exelan Flex is an etch tool, with sources describing it as an etch chamber or etcher.

The Plasma Therm 720/740 is a dual-chamber RIE loadlocked system with chlorine- and fluorine-based chemistry.

The Applied Materials Centura DPS Poly Etcher is a decoupled plasma source etching tool for 6-inch wafers.

The SEZ 203 Spin Processor is an 8-inch spin etcher.

The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.

The Oxford Plasmalab 100 ICP 380 is an etcher, as stated in the product listing.

The Oxford Plasmalab 100 RIE is a reactive ion etching platform for dielectric etching, MEMS, and R&D applications.

The Applied Materials Centura I Phase II Oxide Etcher (also known as the 5200 Centura I Phase II) is an oxide etcher configured for 6-inch wafers with an upgrade path to 200 mm wafers.

The Applied Materials Centura TPCC RTP XE+ is an etcher designed for 8-inch wafers.

The Tokyo Electron Unity II E 855 SS is an etcher for 8-inch wafers.

The Ulvac NE 5500 is an etch tool used in semiconductor manufacturing.

The Ulvac NE 950 EX ICP is an inductively coupled plasma etcher.

The Plasma-Therm 720 RIE is a reactive ion etcher configured for 4-inch wafers.

The Lam Research 590 is a plasma etcher.

The SPTS Rapier is an optimized deep reactive ion etching (DRIE) system for silicon and silicon-on-insulator wafers.

The Lam Alliance A 6 Exelan HPT is a dielectric etch system for 8-inch wafers, equipped with Exelan HPT chambers and a 4520 chamber.

TEL Unity Me is an automatic plasma etching production tool from Tokyo Electron, configured at CMi with a 100mm wafer cassette loader, a transfer chamber, and a DRM process module.

The SEZ SP 323 is a single-wafer wet chemical processor used for spin etching in semiconductor manufacturing.

The Tegal 903 is an etcher in the Tegal 9XX Series Etchers.

The Nordson March AP 300 is a plasma system with a 300 Watt, 13.56 MHz RF generator and an integrated RF automated tuning network assembly.

The Lam Research TCP 9600 is a dry etch system for metal etching, designed for 200 mm wafers.

The Tegal 903ACS is a narrow gap diode reactor system for semiconductor etching of silicon, Ga-As, In-P, and Si-Ge substrates.

The Tokyo Electron Tactras RLSA Process is an etch process chamber for 12-inch wafers used for poly etch.

The Tepla GiGAbatch is a high-frequency plasma tool used for photoresist stripping, wafer surface cleaning, and descumming before wet etching.

The Tegal 6500 HRe- is a dual-frequency etch system series for plasma etching. The Tegal 6500 HRe- uses high-density, capacitively coupled plasma generation and magnetic plasma confinement for precise etching down to the sub-micron level.

The Applied Materials CENG 2 is a dry etcher used in semiconductor manufacturing.

The Lam/SEZ 201 Backside Etcher is a backside etching tool for 8-inch wafers.

The Tegal 701 is an inline automatic wafer RF plasma etcher.

The Lam Research TCP 9400 SE is an inductively coupled plasma etch system used for polysilicon/polycide etch and shallow trench isolation.

The Lam Research 2300 Versys Kiyo Polysilicon Etch is a 300mm wafer plasma etch system designed for polysilicon etching.

The Applied Materials Centura DPS 2 G 5 is a semiconductor etcher with Metal 3ch and Axiom 1ch configuration, manufactured in 2008.

The Plasma-Therm Versaline VCX 600 ICP is a 6-inch inductively coupled plasma etch system.

The Lam 2300 e 5 Kiyo is a three-chamber plus one-strip etch system.

The Applied Materials Centura Super E is an 8-inch etch system with three chambers and wide body loadlocks.

The Lam 2300 V 2 Versys Kiyo 45 is a 12-inch polysilicon etch system.

The Applied Materials Centura eMXP+ is an etch tool for 8-inch wafers, configured for oxide and nitride spacer processes, with a 208 VAC electrical supply and software version E4.8_26.

Applied Materials Centura Dry Etcher is a 3-chamber Ultima dry etcher with 1 cool down and 1 orienter/degas, using BCL3, C2, SF6, He, and Ar gases.

The Applied Materials Centura AP DPS AdvantEdge G 2 Metal is a metal etch system designed for 12 inch wafers.

The Lam Research TCP 9600 is an 8-inch wafer etch tool.

The Applied Materials Centura AP AdvantEdge G 5 Metal is a 300 mm metal etch system.

Oxford Instruments Plasmalab 80+ is a compact open-loading reactive ion etch system for R&D or small-scale production.

The Tegal i90X is a plasma etch system based on the production-proven Tegal 900-series platform, with unlimited recipes, 20X fine set-point control, and a Windows NT touchscreen control system.

The Lam 2300 e 5 Exelan Flex FX is a dielectric etch system for 12-inch wafers.

The Tel VIGSRK Dry Etcher is a dry etching system.

The Lam Rainbow 4400B SN2333 is a Plasma Etch system for 8-inch wafers manufactured by Lam Research.

The Lam Rainbow 4400B SN2622-Parts Machine is a plasma etch tool from Lam Research, configured as a parts machine and accepting 8-inch wafers.

The Lam Research Rainbow 4400B is a plasma etch system for 8-inch wafers.

The Plasma-Therm 790 RIE is a reactive ion etch system configured for silicon substrate processing.

The Lam Research 2300 V 2 Kiyo 45 is an etcher used in semiconductor manufacturing, with some units configured for polysilicon etching and using an Edwards STP XA2703CV pump.

The Branson IPC 4000 C is a plasma etcher.