Waferpedia

Comparison ledger

1540EsB versus CrossBeam 550

Zeiss 1540EsB and Zeiss CrossBeam 550, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
1540EsBZeiss
OEMZeissZeiss
CategoryMetrology & InspectionMetrology & Inspection
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control systemWindows
Generation
FamilyZeiss 1540EsBZeiss CrossBeam 550
Specifications
System typeFIB/SEM system[1]
Electron columnFESEM electron column[1]
Imaging resolutionresolution approaching the 2 nm range[1]
Ion columnGa ion column[1]
Milling capabilityallows for milling (sputtering) of materials from the sample[1]
Deposition materialsPt, W, and SiOx[1]
Gas Injection System etch gasesXeF2 and H2O[1]
Detector optionsmultiple detector options for different imaging modes[1]
ColumnGEMINI II electron optical column[2]
Stage5-axes motorized stage (X, Y, Z (M), Tilt and Rotation)[2]
AirlockSemi-automatic airlock[2]
Vibration compensationActive suspensions to compensate for vibrations[2]
Control softwareZeiss SmartSEM software[2]
Control interfaceControlled via a dual joystick and a dedicated control panel; PC with two monitors[2]
DetectorInLens SE detector[2]
Available software for offline analysis and metrologyProSEM software, MountainsMap 8.2 (coupled to 3DSM Metrology), SmartStitch[2]
Reserved useExclusively reserved for imaging dedicated to control of processes done in CMi by regular CMi users[2]
Sample holdersCarousel 9x10mm, multi-pin holder, Wafer Section, 4 Inch Wafer, 6 Inch Wafer, 6 Inch Mask[2]

Plan your fab

Building a Metrology & Inspection process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]cmdis.rpi.educmdis.rpi.edu
  2. [2]epfl.chepfl.ch