Zeiss
CrossBeam 550
The Zeiss CrossBeam 550 is a scanning electron microscope (SEM) used for imaging and metrology. The CrossBeam 550 is composed of a GEMINI II column and a 5-axes motorized stage. The CrossBeam 550 detects secondary electrons and backscattered electrons for high-resolution imaging.[1]
Plate 01ZEISS Crossbeam 550: Your FIB-SEM for High Throughput 3D Analysis and Sample Preparation
ZEISS MicroscopyWatch on YouTubePlate 02ISTFA Tools of the Trade 2024: ZEISS Crossbeam 550 Samplefab
ASM InternationalWatch on YouTubePlate 03Zeiss Crossbeam 550 SEM Basic Training
Allen HunterWatch on YouTube
Wafer size
6"
Power
20 kV (with beam booster)[1]
Optics
GEMINI II electron optical column[1]
Control era
Windows
What it is
The Zeiss Crossbeam 550 is a FIB-SEM system that combines Gemini 2 SEM imaging with ZEISS Ion-sculptor FIB milling. The Zeiss Crossbeam 550 is positioned for advanced sample preparation and analytics, including 3D tomography, nanofabrication, and TEM lamella preparation.[2]
How it works
The Zeiss Crossbeam 550 pairs Gemini 2 electron optics with an Ion-sculptor FIB column for high-resolution imaging and precise milling. The Zeiss Crossbeam 550 supports live, synchronized imaging during milling, and HDR Mill + SEM is optional. The Zeiss Crossbeam 550 also supports recipe-driven lamella preparation and batch execution through ZEN core EM workflows.[2]
Where it fits in the process flow
General reference — not yet source-verifiedA FIB-SEM sits in characterization, failure analysis, and sample-preparation flows rather than in primary patterning or deposition. A machine in this class is typically used after a structure has been fabricated and needs cross-sectional review, defect localization, subsurface access, or specimen thinning for downstream microscopy.
What can it run?
Process applications and technology nodes documented for this tool.
- Imaging dedicated to process control
- Offline analysis and metrology
- High-resolution SE imaging
- Topography imaging
- Material contrast imaging
- Compositional contrast examinations
- Non-conductive sample imaging
- Angle-selective material characterization
- BSE imaging
Why won't it start?
Documented failure modes, common issues, and field considerations.
- The tool is exclusively reserved for imaging dedicated to process control by regular CMi users.
- Penalty charges apply for unused booking, late cancellations, and mismatch between booked name and operator name.
What do the numbers mean?
Power & electrical3
Vacuum & pumping3
- VPSE detector
- Variable Pressure Secondary Electron detector for imaging non-conductive specimens under variable pressure without extensive sample preparation[1]
Wafer handling7
- Sample holders
- Carousel 9x10mm, multi-pin holder, Wafer Section, 4 Inch Wafer, 6 Inch Wafer, 6 Inch Mask[1]
- Specimen holders
- Carousel 9x10mm, multi-pin holder, Wafer Section, 4 Inch Wafer, 6 Inch Wafer, 6 Inch Mask[1]
- Sample holders
- Carousel 9x10mm, multi-pin holder, wafer section (cleaved samples), 4 inch wafer, 6 inch wafer, 6 inch mask[1]
- Specimen holders
- Carousel 9x10mm, multi-pin holder, wafer section (cleaved samples), 4 inch wafer, 6 inch wafer, 6 inch mask[1]
Optics & imaging15
- Detectors
- InLens SE Detector, SE Detector (Everhart-Thornley type), EsB Detector, aBSD Detector (annular BackScattered electron detector), VPSE Detector[1]
- aBSD detector
- Pneumatically retractable annular backscattered electron detector with five separate diode segments (one inner concentric ring, four outer quadrants)[1]
- EsB detector
- Energy-selective backscattered detector enabling SE and BSE detection; annular shaped in-column detector located above the InLens SE detector[1]
- Chamber cameras
- Chamber CCD camera at backside plus a second CCD camera on the left-hand side of the specimen chamber[1]
Control & software9
- Control interface
- Controlled via a dual joystick and a dedicated control panel; PC with two monitors[1]
- Available software for offline analysis and metrology
- ProSEM software, MountainsMap 8.2 (coupled to 3DSM Metrology), SmartStitch[1]
- Reserved use
- Exclusively reserved for imaging dedicated to control of processes done in CMi by regular CMi users[1]
- Control interface
- Dual joystick for stage control and specimen navigation, plus main keyboard control panel for direct access to 14 frequently used functions[1]
- Software
- Zeiss SmartSEM control software; offline analysis and metrology with ProSEM, MountainsMap 8.2 (coupled to 3DSM Metrology), SmartStitch; automated metrology via InSPEC[1]
Configuration & options16
- Vibration isolation
- Set of active suspensions for vibration compensation (always activated)[1]
Vintage & configurations
Control-system eraWindows[1]
What replaced it?
Related models
- siblingZeiss Merlin— The basic training notes differences between the SEM Crossbeam and SEM MERLIN, and state that being fully trained on SEM MERLIN is a prerequisite.source[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Maximum acceleration voltage20 kV (with beam booster)[1]
- AirlockSemi-automatic airlock for fast specimen transfer and fast pumping times[1]
- VPSE detectorVariable Pressure Secondary Electron detector for imaging non-conductive specimens under variable pressure without extensive sample preparation[1]
- SE detectorEverhart-Thornley type detector; collector voltage variable between -250 V and +400 V[1]
- Beam boosterBooster voltage always at high potential when acceleration voltage is 20 kV or less[1]
- Available detectorVariable Pressure Secondary Electron (VPSE) detector[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of instrument is the Zeiss Crossbeam 550?
The Zeiss Crossbeam 550 is a FIB-SEM system that combines Gemini 2 SEM imaging with ZEISS Ion-sculptor FIB milling.[2]
Does the Zeiss Crossbeam 550 support live imaging during milling?
The Zeiss Crossbeam 550 allows live, synchronized imaging during milling so that structures can be monitored as material is removed. HDR Mill + SEM is optional.[2]
What lamella-preparation steps does the Zeiss Crossbeam 550 support?
The Zeiss Crossbeam 550 supports chunking, thinning, lift-out, and on-grid attachment in integrated TEM lamella preparation workflows.[2]
Not publicly documented
The following facts about the CrossBeam 550 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CrossBeam 550 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CrossBeam 550 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The process node or technology generation of the CrossBeam 550 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the CrossBeam 550 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the CrossBeam 550 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Last updated Oct 20, 2026.
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