Waferpedia

Comparison ledger

1540EsB versus O Inspect 322 CMM

Zeiss 1540EsB and Zeiss O Inspect 322 CMM, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
1540EsBZeiss
OEMZeissZeiss
CategoryMetrology & InspectionMetrology & Inspection
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyZeiss 1540EsBZeiss O Inspect 322 CMM
Cited variants
  • O-INSPECT 3 / 2 / 2[1]
Specifications
System typeFIB/SEM system[2]
Electron columnFESEM electron column[2]
Imaging resolutionresolution approaching the 2 nm range[2]
Ion columnGa ion column[2]
Milling capabilityallows for milling (sputtering) of materials from the sample[2]
Deposition materialsPt, W, and SiOx[2]
Gas Injection System etch gasesXeF2 and H2O[2]
Detector optionsmultiple detector options for different imaging modes[2]
ConfigurationMeasuring volume X = 300 mm, Y = 200 mm, Z = 200 mm[3]
P/N636520-9932-000[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]cmdis.rpi.educmdis.rpi.edu
  3. [3]inventory listing