Comparison ledger
Zeiss 1540EsB and Zeiss O Inspect 322 CMM, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 1540EsBZeiss | O Inspect 322 CMMZeiss |
|---|---|---|
| OEM | Zeiss | Zeiss |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Zeiss 1540EsB | Zeiss O Inspect 322 CMM |
| Cited variants | — |
|
| Specifications | ||
| System type | FIB/SEM system[2] | — |
| Electron column | FESEM electron column[2] | — |
| Imaging resolution | resolution approaching the 2 nm range[2] | — |
| Ion column | Ga ion column[2] | — |
| Milling capability | allows for milling (sputtering) of materials from the sample[2] | — |
| Deposition materials | Pt, W, and SiOx[2] | — |
| Gas Injection System etch gases | XeF2 and H2O[2] | — |
| Detector options | multiple detector options for different imaging modes[2] | — |
| Configuration | — | Measuring volume X = 300 mm, Y = 200 mm, Z = 200 mm[3] |
| P/N | — | 636520-9932-000[1] |
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