Waferpedia

Comparison ledger

1540EsB versus UEM

Zeiss 1540EsB and Zeiss UEM, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
1540EsBZeiss
UEMZeiss
OEMZeissZeiss
CategoryMetrology & InspectionMetrology & Inspection
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyZeiss 1540EsBZeiss UEM
Specifications
System typeFIB/SEM system[1]
Electron columnFESEM electron column[1]
Imaging resolutionresolution approaching the 2 nm range[1]
Ion columnGa ion column[1]
Milling capabilityallows for milling (sputtering) of materials from the sample[1]
Deposition materialsPt, W, and SiOx[1]
Gas Injection System etch gasesXeF2 and H2O[1]
Detector optionsmultiple detector options for different imaging modes[1]
ConfigurationBrightfield[2]
Illumination TypeReflected Light[2]
Binocular Angle45°[2]
Magnification8X[2]
Magnification Changer1.25X, 1.6X, 2X[2]
Illumination Power12 V, 60 watts[2]
Power Supply includedYES[2]
Stage TypeCoaxial X-Y[2]
Length273 mm (10.78 in)[2]
Width356 mm (14.016 in)[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]cmdis.rpi.educmdis.rpi.edu
  2. [2]inventory listing