Comparison ledger
Zeiss Merlin and Zeiss Orion NanoFab, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | MerlinZeiss | Orion NanoFabZeiss |
|---|---|---|
| OEM | Zeiss | Zeiss |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | 4" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Zeiss Merlin | Zeiss Orion NanoFab |
| Specifications | ||
| Instrument type | Scanning electron microscope (SEM)[1] | Focused ion beam (FIB) microscope[2] |
| Column | GEMINI II[1] | — |
| Stage | 5-axis motorized stage (X, Y, Z, Tilt and Rotation)[1] | — |
| Loadlock | Semi-automatic airlock[1] | — |
| Control software | ZeissSmartSEM[1] | — |
| Available holders | mono samples, cleaved samples, and full 4 inch wafer[1] | — |
| Detectors | In-Lens, HE-SE2, EsB, and EDX detector[1] | — |
| Functions | — | Ultrahigh-resolution imaging, direct writing, and lithography platform[2] |
| Beam species | — | Operates with either He or Ne[2] |
| He beam probe | — | ~0.5 nm[2] |
| He beam imaging performance | — | Produces sub-5 nm resolution images and patterns with large depth of field[2] |
| Ne beam application range | — | Direct write and lithography applications between 10 and 100 nm[2] |
| Sample capability | — | Non-conductive samples can be imaged with the aid of an electron flood gun[2] |
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