Comparison ledger
ABM 3 HR Mask Aligner UV Exposure, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | |
|---|---|---|
| OEM | ABM | EV Group |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM 3 HR Mask Aligner UV Exposure | EV Group 101 |
| Specifications | ||
| Configuration | Precision alignment stage[1] | — |
| Mask Holder | 4” x 4” with 3” diameter substrate holder[1] | — |
| Voltage | 120V, 50/60 Hz.[1] | — |
| Power | 120V, 50/60 Hz[1] | — |
| Performance | Precision alignment stage[1] | — |
| Substrate size compatibility | Chuck and mask holder available for 2" substrates[1] | — |
| Substrate size limitation | System will not do larger substrates[1] | — |
| Optics | Exposure timer[2] | — |
| Imaging | Splitfield Zeiss microscope for easier alignment[1] | — |
| OEM | — | EV Group[3] |
| Model | — | 101[3] |
| Equipment name | — | EVG 101 Spray Coater[3] |
| NEMO ID | — | evgspraycoat[3] |
| Training required | — | EVG 101 Training[3] |
| Training duration | — | 1.50 hours[3] |
| Processing technique | — | Resist Spray Coat (manual)[3] |
| Cleanliness | — | "All"[3] |
| Location | — | SNF Paul G Allen L107 Cleanroom[3] |
| Wafer diameter (substrate size) | — | up to 300 mm[4] |
| Available modules | — | Spin coat / OmniSpray® / develop[4] |
| Wafer handling options | — | Bowed / warped / thin wafer handling, edge handling[4] |
| Dispense options | — | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[4] |
| Processing technique (at SNF) | — | Resist Spray Coat (manual)[5] |
| Cleanliness group (at SNF) | — | "All"[3] |
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