Comparison ledger
Accretech UF 3000 EX Automatic Wafer, Electroglas EG 4090 u+, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 3000 EX Automatic WaferAccretech | EG 4090 u+Electroglas |
|---|---|---|
| OEM | Accretech | Electroglas |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF 3000 | Electroglas EG 4090 |
| Cited variants | — |
|
| Specifications | ||
| OS Ver | S6.39.BH[3] | — |
| Input | AC 210V Single pulse[3] | — |
| Configuration | 12" Nickel Hot Chucktop[3] | EG Commander version 9.3 series[6] |
| Head Plate Center Hole Size | 528mm[3] | — |
| Type | Automatic wafer prober[4] | — |
| Hot temp controller | Room~150C[3] | — |
| OS version | S6.39.BH[3] | — |
| Chucktop | 12" Nickel Hot Chucktop[3] | — |
| Z stage | Standard Z Force Stage[3] | — |
| Loader | Open Foub Single Loader[3] | — |
| OCR | Type 6 OCR (Rear-Face Only)[3] | — |
| Probe card tray | Auto Probe Card Tray (O)[3] | — |
| Cleaning unit block | Cleaning Unit Block (O), Cleaning Ceramic Plate(X)[3] | — |
| Ports | USB Port; Ethernet Port[3] | — |
| Card holder clamp motor option | No[3] | — |
| Auto tilt option | No[3] | — |
| Configured wafer sizes | 8" or 12" wafers[5] | — |
| Chuck type | Nickel[5] | — |
| FOUP port | Single FOUP port for 25 wafers[5] | — |
| Transport | Dual robotic wafer transport arms[5] | — |
| Alignment | Auto needle alignment; advanced wafer alignment unit; alignment camera E1-500[5] | — |
| Stage | Quad-Pod Z stage[5] | — |
| Interface options | GPIB interface option; Ethernet interface option[5] | — |
| Frequency | — | 50 Hz[6] |
| Phase | — | 1 Phase, 2 Wires[6] |
| Voltage | — | 230 V[7] |
| Power | — | 1.7 KVA[7] |
| Wafer size | — | 8 inch[1] |
| Software | — | EG Commander version 9.3 series[6] |
| Operating system | — | Windows 2000[6] |
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