Waferpedia

Comparison ledger

0010 47763versusM Plex Multiplex ICP

Applied Materials 0010 47763, STS M Plex Multiplex ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
OEMApplied MaterialsSTS
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763STS M Plex Multiplex ICP
Specifications
Configuration2nd Source New[1]MAG 900 CT Turbo pump[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]—
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Voltage—400 V[4]
Frequency—50 Hz[4]
Phase—3 Phase[4]
Roughing Pump Code—A532-80-905[4]
Wafer Size—3 inch[4]
Turbo Pump—MAG 900 CT Turbo pump[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing