Comparison ledger
Applied Materials Centura AP Enabler Dielectric, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Centura AP Enabler DielectricApplied Materials | 110Tegal |
|---|---|---|
| OEM | Applied Materials | Tegal |
| Category | Etch | Etch |
| Wafer size | Diameter 300+/- 0.05mm(SEMI M28), 775 +/- 25um, Notch | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Centura | Tegal 110 |
| Cited variants |
|
|
| Specifications | ||
| Configuration | HDD not included[3] | — |
| Wafer Size | Diameter 300+/- 0.05mm(SEMI M28), 775 +/- 25um, Notch[3] | — |
| Online Connection | GEM / CIM JGJ (Hardware Interface : Ethernet 100Base-Tx)[3] | — |
| Inter Face | 3 carrier stage (Continuous flow operation) w/ 3 Loadports (Semi compliant[3] | — |
| Interface A | Hardware related to EDA[3] | — |
| Corrosion Resistant FI & SWLL | N/A[3] | — |
| Loader Mod Corrosion Prevent | N/A[3] | — |
| Standard SWLL | Standard SWLL[3] | — |
| Side Storage Pod | Side Storage Pod (Left/Right)[3] | — |
| OCR | KIT, YAT BACKSIDE OCR, 300MM 5.3FI[3] | — |
| Facility Plate | N2 Regulator : Supplied by customer in floor, CDA regulator 125 PSI onboard[3] | — |
| Transfer Pressure Monitor | 10 Torr Manometer and 1SLM N2 APC, kit[3] | — |
| Load Lock Pressure Monitor | GAUGE VAC MINI-CONVECTRON W/1-SETPOINT CAJON FTG analog[3] | — |
| Transfer Chamber Blade Kit | Transfer Chamber Accelerator Blade Kit[3] | — |
| LL ISO-Slit Valve Grp Elast. | AP Chemraz 513 Elastomer[3] | — |
| Interface | 3 carrier stage (Continuous flow operation) w/ 3 Loadports (Semi compliant[3] | — |
| Atmospheric Robot | KAWASAKI A3[3] | — |
| Mainframe Robot | VXP with Dual blade[3] | — |
| Loadport Type | Enhanced 25 wafer FOUP[3] | — |
| Loadports | Loadport System[3] | — |
| EMO Type | Turn to Release (Front x3, Rear x4) - 3 on FI, 1 on front of FI and one on each side of FI. Rear: 1 for each process chamber.[3] | — |
| System Monitors | Monitor #1 is Flat Panel with Keyboard on stand / Monitor #2 is through the wall flat panel (optional)[3] | — |
| Voltage | 208V, 50/60Hz[3] | — |
| Vintage | 2010[3] | — |
| Description | Dielectric Etch[4] | — |
| Version | 300mm[5] | — |
| Process Chambers | 4 process chambers[1] | — |
| Fab Interface Type | Centura Etch 5.3 FAC. Frame 5.3 Fi Rev 002[1] | — |
| RF Gen Top (162MHz Source) | 3500W RF POWER SUPPLY, 162 MHZ, FIXED FREQUENCY, 208VAC, WATER COOLED (0190-29389)[1] | — |
| RF Gen #1 Bottom (13MHz Bias) | RF GENERATOR, 13MHZ 5KW, 300MM, RACK MOUNT (0190-15319)[1] | — |
| RF Gen #2 Bottom (2MHz Bias) | RF GEN PLASMA 9KW 2MHZ ENI (0190-29586)[1] | — |
| Endpoint Type | Endpoint type (Eye-D) (0246-00196)[1] | — |
| TMP | Shimadzu D3403M, 3000 litre TMP[1] | — |
| Dry Pump | N(ESR80WN (EBARA); customer Supply)[1] | — |
| Chamber Controller Module | SBC C400MHZ, 3U CPCI, 256MB RAM[1] | — |
| Gas Line 1 | C4F6 100 sccm UNIT IFC-125[1] | — |
| Gas Line 2 | CH2F2 100 sccm UNIT IFC-125[1] | — |
| Gas Line 3 | C3F8 50 sccm UNIT IFC-125[1] | — |
| Gas Line 4 | O2_M 300 sccm UNIT-125[1] | — |
| Gas Line 5 | SO2 200 sccm UNIT IFC-125[1] | — |
| Gas Line 6 | CF4 200 sccm UNIT IFC-125[1] | — |
| Gas Line 7 | C4F6_IGI 5 sccm UNIT-125[1] | — |
| Gas Line 8 | O2_IGI 5 sccm UNIT-125[1] | — |
| Gas Line 9 | O2_L 50 sccm UNIT-125[1] | — |
| Gas Line 10 | O2_H 5000 sccm UNIT-125[1] | — |
| Gas Line 11 | Ar 2000 sccm UNIT-125[1] | — |
| Gas Line 12 | N2 200 sccm UNIT-125[1] | — |
| Gas Line 13 | CHF3 200 sccm UNIT-125[1] | — |
| Gas Line 14 | C4F8 100 sccm UNIT-125[1] | — |
| Source Bottom Ring | QUARTZ RING SOURCE, E5 (0200-07362)[1] | — |
| Showerhead Assy | Showerhead Assy, 4mm SiC Top Electrode Tokai (0041-32335)[1] | — |
| Wafer Pass Through | Not available[3] | — |
| Manufacturer | Applied Materials[3] | — |
| Model | Centura AP Enabler[3] | — |
| Equipment type | Dielectric Etcher[3] | — |
| Power | 208V, 50/60Hz[3] | — |
| Model variant | Centura AP Enabler E5[1] | — |
| Fab interface type | Centura Etch 5.3 FAC[1] | — |
| CE mark | Has CE Mark[1] | — |
| model | — | 110 SE[2] |
| application focus | — | process development applications[2] |
| process capability | — | deep silicon plasma etching[2] |
| capabilities | — | very high aspect ratio trench etch and profile control[2] |
| configuration | — | multiple configurations with minimum technical intervention[2] |
| System type | — | plasma etch system[6] |
| Supported components | — | MEMS and 3D-IC components[2] |
| Control capability | — | very high aspect ratio trench etch and profile control[6] |
| Physical description | — | compact[2] |
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