Comparison ledger
Applied Materials Centura DPS+ Poly Silicon, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Centura DPS+ Poly SiliconApplied Materials | 110Tegal |
|---|---|---|
| OEM | Applied Materials | Tegal |
| Category | Etch | Etch |
| Wafer size | Wafer Mapping | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Centura | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Through the Wall[2] | — |
| Voltage | 208 VAC, 3 Phase, 60 Hz[2] | — |
| Full Load Current | 250 A[2] | — |
| Maximum System Rating | 90 KVA[2] | — |
| Rating of LArgest Load | 175 A[2] | — |
| Software Version | 4.8_26[2] | — |
| Wafer size | Wafer Mapping[2] | — |
| Load Lock Type | Narrow Body[2] | — |
| Robot Type | HP+[2] | — |
| Gas Panel Type | Seriplex[2] | — |
| System Controller | 5200 only[2] | — |
| Wafer sizes | 6 inch[2] | — |
| System configuration | Position A: DPS Plus, Position B: DPS Plus, Position D: DPS Plus, Position F: Wafer Orienter[2] | — |
| Voltage/Phase | 208 VAC, 3 Phase, 60 Hz[2] | — |
| System controller | 5200[2] | — |
| ESC type | Polyimide[2] | — |
| Upper chamber part number | 0010-13833[2] | — |
| Throttle valve part number | 0016-39645[2] | — |
| Turbo chamber positions | Alcatel STPA 2203 CV at positions A, B, D[3] | — |
| RF microwave generators | ACG-6B-02, ATLAS 2012 at positions A and B[3] | — |
| Heat exchanger | AMAT 1, quantity 2[3] | — |
| Vintage | 1997[2] | — |
| Position A | Chamber Type DPS Plus[2] | — |
| Position B | Chamber Type DPS Plus[2] | — |
| Position D | Chamber Type DPS Plus[2] | — |
| Position F | Chamber Type Wafer Orienter[2] | — |
| Throttle Valve P/N | 0016-39645[2] | — |
| OEM | Applied Materials[2] | — |
| Model | Centura DPS+[2] | — |
| Category | Etch[3] | — |
| Wafer mapping | Yes[2] | — |
| Power | 208 VAC, 3 Phase, 60 Hz[3] | — |
| Electrostatic chuck | Polyimide[2] | — |
| Through the wall | Yes[2] | — |
| All cables present | Yes[2] | — |
| Independent backside HE cool | Yes[2] | — |
| Signal lamp tower | Yes[2] | — |
| Remote service monitors | Yes[2] | — |
| Position A chamber type | DPS Plus[3] | — |
| Position B chamber type | DPS Plus[3] | — |
| Position D chamber type | DPS Plus[3] | — |
| Position F chamber type | Wafer Orienter[3] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[4] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[4] |
| Physical description | — | compact[1] |
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