Waferpedia

Comparison ledger

Centura I Phase II Oxideversus1512e

Applied Materials Centura I Phase II Oxide, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura I Phase II OxideApplied Materials
1512eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials CenturaTegal 1512e
Specifications
ConfigurationUpgradable to 8"[1]—
Need to replace5-phase motor driver, indexer, turbo pump and controller, e-chuck, MFC's[1]—
Wafer size (original)6 inch[1]—
Wafer size (upgrade target)8 inch (200 mm)[1]—
Wafer size (alternate configuration)200 mm[2]—
Model designation alternative5200 Centura I Phase II[2]—
Tool type—Industrial RIE plasma etcher system[3]
Stated configuration—With modules assembly for CI-4222[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]semistarcorp.comsemistarcorp.com