Applied Materials
Centura I Phase II Oxide
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedThe Applied Materials Centura I Phase II is a cluster tool platform for semiconductor wafer processing.
The Centura I Phase II Oxide (Etch) configuration is an oxide etcher designed for dielectric etching.
How it works
General reference — not yet source-verifiedA Centura cluster tool typically consists of a central wafer-handling robot that moves wafers among multiple processing chambers and a loadlock.
Oxide etchers use a plasma-based process to remove silicon dioxide (oxide) material from the wafer surface, typically employing a reactive-ion etch (RIE) mechanism.
Where it fits in the process flow
General reference — not yet source-verifiedOxide etching is a critical step in semiconductor manufacturing, occurring after dielectric layer deposition and before subsequent metallization or patterning steps.
The etcher is used to create vias, contacts, and trenches in oxide layers for interconnect formation and device isolation.
Applications
General reference — not yet source-verifiedOxide etchers are used to etch silicon dioxide and other dielectric materials in the fabrication of integrated circuits.
Common applications include contact hole etching, via etching in interlayer dielectrics, and shallow trench isolation (STI) etching.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Need to replace 5-phase motor driver, indexer, turbo pump and controller, e-chuck, MFC's
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Need to replace5-phase motor driver, indexer, turbo pump and controller, e-chuck, MFC's[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Centura I Phase II Oxide are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura I Phase II Oxide are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura I Phase II Oxide are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura I Phase II Oxide are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Centura I Phase II Oxide is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Centura I Phase II Oxide are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]fabsurplus.comfabsurplus.com
Last updated Aug 14, 2026.