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Comparison ledger

200 SpinversusGasonics Gamma 2130 Photoresist Stripper

CEE 200 Spin, Lam Research Gasonics Gamma 2130 Photoresist Stripper, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMCEELam Research
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200Lam Research Gasonics
Specifications
Phase1 Phase[1]—
TypeSpin Coater[1]—
Model200[1]Gamma 2130[3]
MakeCEE[1]Lam / Novellus / Gasonics[3]
Wafer Sizes8 inch[1]—
Configuration1 Phase[1]System Configuration:[3]
Equipment typeSpin Coater[1]Photoresist Stripper[3]
Spin speed5000 rpm[2]—
Substrate supportFlat substrates up to 200 mm or fragments[2]—
Substrate thickness max12 mm[2]—
Coating thicknessUniform coating thickness up to 100 µm[2]—
Load Port—Brooks Fixload TM V6[3]
EFEM Robot—02-169208-00[3]
Aligner—Yaskawa[3]
RF Rack—Generator ENI GHW-50A-04 5ea[3]
Light Curtain—Keyence[3]
EPD—4ea(#2,#3,#4,#5 Port)[3]
RF Matcher—CPMX-3000 5ea[3]
RF Source—02-352103-00 5ea[3]
HDIS Pedestal—#2, #3, #,1, #6[3]
Fixed Pedestal—#4, #5[3]
Stage #1—Preheat[3]
Category—Resist Processing[5]
RF rack generator—ENI GHW-50A-04, 5ea[3]
Gate valve—MDC ISO Valve[3]
Throttle valve—NC[3]
Slit valve—V-TEX[3]
Manometer—MKS 10 Torr[3]
Gas box MFC #1—Brooks O2[3]
Gas box MFC #2—Brooks N2[3]
Gas box MFC #3—Brooks H2N2[3]
Gas box MFC #4—Brooks CF4[3]
Manometor—MKS 10 Torr[3]
Gas Box—MFC #1 Brooks O2, MFC #2 Brooks N2, MFC #3 Brooks H2N2, MFC #4 Brooks CF4[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]amolf.nlamolf.nl
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com