Comparison ledger
CEE 200 Spin, SUSS MicroTec ACS 300, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 SpinCEE | ACS 300SUSS MicroTec |
|---|---|---|
| OEM | CEE | SUSS MicroTec |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 200 | SUSS MicroTec ACS 300 |
| Specifications | ||
| Phase | 1 Phase[1] | — |
| Type | Spin Coater[1] | — |
| Model | 200[1] | ACS 300[3] |
| Make | CEE[1] | — |
| Wafer Sizes | 8 inch[1] | — |
| Configuration | 1 Phase[1] | Developer (4)[3] |
| Equipment type | Spin Coater[1] | Developer[3] |
| Spin speed | 5000 rpm[2] | — |
| Substrate support | Flat substrates up to 200 mm or fragments[2] | — |
| Substrate thickness max | 12 mm[2] | — |
| Coating thickness | Uniform coating thickness up to 100 µm[2] | — |
| OEM | — | SUSS MicroTec[3] |
| Wafer sizes | — | 8 inch, 12 inch[3] |
| Vintage | — | 2008[3] |
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