Comparison ledger
CEE 200 Spin, SUSS MicroTec Delta 80 Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 SpinCEE | Delta 80 SpinSUSS MicroTec |
|---|---|---|
| OEM | CEE | SUSS MicroTec |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 200 | SUSS MicroTec Delta |
| Cited variants | — |
|
| Specifications | ||
| Phase | 1 Phase[2] | 3 Phase + N + PE[4] |
| Type | Spin Coater[2] | Spin Coater / Developer[4] |
| Model | 200[2] | Delta 80[4] |
| Make | CEE[2] | — |
| Wafer Sizes | 8 inch[2] | — |
| Configuration | 1 Phase[2] | Software is not included[4] |
| Equipment type | Spin Coater[2] | — |
| Spin speed | 5000 rpm[3] | — |
| Substrate support | Flat substrates up to 200 mm or fragments[3] | — |
| Substrate thickness max | 12 mm[3] | — |
| Coating thickness | Uniform coating thickness up to 100 µm[3] | — |
| Voltage | — | 400 V, 50 Hz[4] |
| Technology | — | GYRSET closed cover coating technology[1] |
| Wafer capacity | — | wafers up to 8 in (200 mm)[1] |
| Substrate capacity | — | substrates up to 6 in x 6 in (150 x 150 mm)[1] |
| Process capability | — | delicate wafer fragments[1] |
| Operation | — | fully programmable process parameters[1] |
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