Comparison ledger
CEE 200 Spin, SVG 86, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 SpinCEE | 86SVG |
|---|---|---|
| OEM | CEE | SVG |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 200 | SVG 86 |
| Specifications | ||
| Phase | 1 Phase[1] | — |
| Type | Spin Coater[1] | Coater/Developer[3] |
| Model | 200[1] | — |
| Make | CEE[1] | — |
| Wafer Sizes | 8 inch[1] | — |
| Configuration | 1 Phase[1] | — |
| Equipment type | Spin Coater[1] | — |
| Spin speed | 5000 rpm[2] | — |
| Substrate support | Flat substrates up to 200 mm or fragments[2] | — |
| Substrate thickness max | 12 mm[2] | — |
| Coating thickness | Uniform coating thickness up to 100 µm[2] | — |
| Track 1 | — | Sender - Coat - Receiver[3] |
| Track 2 | — | Sender - Developer - Receiver[3] |
| Wafer size range | — | 2" to 200mm[4] |
| Wafer shape | — | Round and square[4] |
| Robotic wafer handling | — | Yes[4] |
| Control | — | PC-based graphical user programming, touch screen control[4] |
| Recipe management software | — | Nettrack[4] |
| Barcode input | — | Optional[4] |
| Track configuration | — | Track 1: Sender - Coat - Receiver; Track 2: Sender - Developer - Receiver[3] |
| Tool type | — | Coater / Developer[3] |
| Wafer capability | — | Round and square wafers from 2" to 200mm[4] |
| Wafer handling | — | Robotic wafer handling[4] |
| Operator interface | — | PC-based graphical user programming and touch screen control[4] |
| Recipe management | — | Nettrack recipe management software[4] |
| Optional input | — | Optional barcode input[4] |
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