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Comparison ledger

200 Spinversus3303 Lift Off

CEE 200 Spin, Veeco 3303 Lift Off, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMCEEVeeco
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200Veeco 33xx
Specifications
Phase1 Phase[1]—
TypeSpin Coater[1]—
Model200[1]3303[3]
MakeCEE[1]—
Wafer Sizes8 inch[1]—
Configuration1 Phase[1]HVS (High Velocity Spray) Chamber up to 40 PSI[3]
Equipment typeSpin Coater[1]—
Spin speed5000 rpm[2]—
Substrate supportFlat substrates up to 200 mm or fragments[2]—
Substrate thickness max12 mm[2]—
Coating thicknessUniform coating thickness up to 100 µm[2]—
HPC solvent lift off process—500-2300 PSI1)[3]
Machine type—Lift Off Machine[4]
Wafer size—6 inch[3]
Process—HPC solvent lift off process[3]
Process pressure—500-2300 PSI[3]
Chamber pressure—up to 40 PSI[4]
OEM—Veeco / SSEC[3]
HVS chamber pressure—up to 40 PSI[3]
Vintage—2006[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]amolf.nlamolf.nl
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com