Waferpedia

Comparison ledger

DFL 7161versus1000P

Disco DFL 7161, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMDiscoYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Acquisition
Control system——
Generation——
FamilyDisco DFL 7161YES 1000P
Specifications
Processing methodAblation[1]—
Max workpiece sizeΦ300 mm[1]—
X-axis Processing range310 mm[1]—
X-axis Moving speed1 - 1000 mm/s[1]—
Y-axis Processing range310 mm[1]—
Y-axis Index step0.0001 mm[1]—
Y-axis Positioning accuracy0.003/310 (Single error) 0.002/5[1]—
Z-axis Moving resolution0.000015 mm[1]—
Z-axis Repeatability accuracy0.002 mm[1]—
θ-axis Max. rotating angle330 deg (standard) 380 deg (option)[1]—
Equipment dimensions (W×D×H)1560 × 1550 × 1800 mm[1]—
Equipment weightApprox. 2300 kg[1]—
Model—1000P[2]
System type—Plasma cleaning system[2]
Shelf configuration—Four 16 x 16 inch shelves[2]
Total capacity—1024 square inches[2]
Control system—PLC driven with plain English real time process readout and diagnostics in the event of system abort[2]
Number of shelves—4[2]
Shelf size—16 x 16 inches[2]
Power—1000 W[3]
Configuration—Parallel plate[3]
Operation modes—Active, RIE, Downstream[2]
Sample size range—From smallest semiconductor chip to large flat panels[2]
Type—Plasma cleaning system[2]
Shelves—Four 16 x 16 inch shelves[2]
Control—PLC driven with plain English real time process readout and diagnostics in the event of system abort[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]disco.co.jpdisco.co.jp
  2. [2]web.archive.orgweb.archive.org
  3. [3]semistarcorp.comsemistarcorp.com