Comparison ledger
Disco DFL 7340 Laser Dicing, Disco DFL 7340 Stealth Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFL 7340 | Disco DFL 7340 |
| Specifications | ||
| Phase | 3 phase[1] | — |
| Tool type | laser dicing saw[1] | — |
| Power | 3 phase[1] | — |
| Wafer sizes | 6 inch[2] | — |
| Process wavelength | IR[3] | — |
| Wafer diameter | 200mm wafers or smaller (6in, 4in, 3in, coupon, wafer quarter)[3] | — |
| Maximum wafer thickness | up to 1.5 mm[3] | — |
| Multi-project wafers | MPW dicing capabilities[3] | — |
| Back side alignment | IR camera[3] | — |
| Feeding speed | 1.0 – 1000 mm/s[3] | 1.0–1000 mm/s[3] |
| Position accuracy | 3µm[3] | 3 µm[3] |
| Configuration | — | Power supply removed[4] |
| OEM | — | Disco[5] |
| Model | — | DFL7340[5] |
| Process area | — | Packaging[5] |
| Purpose | — | Laser Stealth dicing of Si wafers[3] |
| Applications field | — | Contact-less dicing of Silicon wafers PICs, MEMS, BIO-MEMS and Semiconductor non-wet dicing[3] |
| Wavelength | — | 1342 nm[5] |
| Maximum sample diameter | — | 200 mm[5] |
| Wafer size | — | 200 mm or smaller[3] |
| Compatible materials | — | Si wafers only[5] |
| Dicing orientation | — | Topside or backside (through tape) dicing possible[5] |
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