Comparison ledger
Electroglas EG5, SUSS MicroTec PM5, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EG5Electroglas | PM5SUSS MicroTec |
|---|---|---|
| OEM | Electroglas | SUSS MicroTec |
| Category | Test & Probe | Test & Probe |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Electroglas EG5 | SUSS MicroTec PM5 |
| Cited variants | — | |
| Specifications | ||
| Product line | EG5|300[1] | — |
| Variant | ARGOS[1] | — |
| Description | Electroglas' highest accuracy 300mm wafer prober[1] | — |
| Probe-to-pad accuracy | ±2.5 micron[1] | — |
| Stepping accuracy | 1.0 micron[1] | — |
| Wafer sizes handled | 150mm, 200mm, and 300mm wafers[1] | — |
| Variant description | Fine-pitch probing for in-line parametric test structures[1] | — |
| Tool type | wafer prober[1] | — |
| Accuracy positioning | probe-to-pad accuracy of ±2.5 micron[1] | — |
| Handled wafer sizes | 150mm, 200mm, 300mm[1] | — |
| Model relation | EG5|300e is a fine-pitch probing model for in-line parametric test structures[1] | — |
| system type | — | analytical probe system[2] |
| wafer/substrate diameter | — | up to 150 mm (6″)[2] |
| measurement modes | — | DC and HF measurements[2] |
| failure analysis use | — | suitable as a failure analysis tool[2] |
| probe heads | — | up to 12 SUSS probe heads at one time[2] |
| manipulator probe function | — | nanowires may be picked and placed onto a device or substrate[2] |
| Measurement types | — | DC and HF[2] |
| Max probe heads | — | up to 12 SUSS probe heads[2] |
| Manipulator probe | — | for nanowire pick-and-place[2] |
| Wafer/substrate diameter | — | up to 150 mm (6 in)[2] |
| Failure analysis | — | suitable as a failure analysis tool[2] |
| Contact points | — | up to 4 contact points can be operated independently at the same time[3] |
| Manufacturer | — | SÜSS MicroTec AG[3] |
| Category | — | Characterization[3] |
| Supported substrate diameter | — | up to 150 mm (6 in)[2] |
| Supported wafers, chips, and substrates | — | wafers, chips and substrates up to 150 mm[3] |
| Maximum probe heads | — | up to 12 SUSS probe heads at one time[2] |
| Nanowire handling | — | nanowires may be picked and placed onto a device or substrate[2] |
| Probe head motion | — | X, Y, Z movements[3] |
| Platen height adjustment | — | up to 40 mm[3] |
| Additional contact separation | — | 200 μm[3] |
| Microscope objectives | — | ExtraLongWorkingDistance 2x, 10x, 20x objectives and 10x ocular[3] |
| Chuck stage motion | — | X, Y and Z moved[3] |
| Chuck stage thermal control | — | can be heated/cooled[3] |
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