Comparison ledger
KLA 0035235-003 MMD Head, KLA F 50 Thin Film Thickness Mapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | KLA F |
| Cited variants | — | |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[3] | Model 205-0881[1] |
| Model | 0035235-003[3] | F 50[4] |
| Make | KLA[3] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[3] | — |
| Compatible System | KLA AIT-XP[3] | — |
| Software version | — | 9.6.9.0[1] |
| Beginning / Ending nm | — | 378.90 / 1050.80[1] |
| Integration Time at 3000 Counts on | — | Si 3.1 ms[1] |
| Manufacturer | — | KLA / Filmetrics[4] |
| Sub-model | — | 205-0881[1] |
| Spectral Range Start | — | 378.90 nm[1] |
| Spectral Range End | — | 1050.80 nm[1] |
| Integration Time | — | 3.1 ms at 3000 counts on Si[1] |
| Model number variant | — | 205-0881[1] |
| Spectral range (beginning nm) | — | 378.90[1] |
| Spectral range (ending nm) | — | 1050.80[1] |
| Integration time at 3000 counts on Si | — | 3.1 ms[1] |
| OEM / Make | — | KLA / Filmetrics[1] |
| Product Type | — | Thin Film Thickness Mapper[1] |
| Listed Model Designation | — | 205-0881[1] |
| Wavelength Range | — | 378.90 to 1050.80 nm[1] |
| Model designation | — | 205-0881[1] |
| Wavelength range | — | 378.90 nm - 1050.80 nm[1] |
| Instrument type | — | Automated thin-film thickness mapping system[2] |
| Stage | — | Motorized R-theta stage[2] |
| Maximum wafer diameter | — | Up to 450 mm[2] |
| Measurement speed | — | As fast as two points per second[2] |
| Measurement wavelength range | — | 380 to 1050 nm[2] |
| Spectral range | — | 378.90 nm to 1050.80 nm[1] |
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