Comparison ledger
KLA .204 PSL Wafer, Koh Young KY8030-2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | KY8030-2Koh Young | |
|---|---|---|
| OEM | KLA | Koh Young |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA .204 PSL Wafer | Koh Young KY8030-2 |
| Specifications | ||
| Configuration | NIST Traceable[1] | — |
| Wafer Size | 8 inch[2] | — |
| Traceability | NIST[3] | — |
| Compatible Tools | Surfscan 6xy0, Sp1[1] | — |
| NIST Traceable | Yes[2] | — |
| Compatible tools | Surfscan 6xy0 and Sp1 particle counters[2] | — |
| Manufacturer | — | Koh Young[4] |
| Product category | — | Solder Paste Inspection System (SPI)[4] |
| Product type | — | 3D solder paste inspection system (SPI)[5] |
| Measured quantities | — | Paste height, area, and volume[5] |
| Inspection speed | — | 11.1 to 59.5 cm²/sec[5] |
| Field of view | — | 20x20 to 50x50 millimetres[5] |
| Resolution | — | 10, 15, 20, or 25 microns[5] |
| Formats | — | M, L, and XL[5] |
| Z resolution | — | 0.37 microns[5] |
| Height accuracy | — | 1 micron[5] |
| Gage R&R | — | Under 10 percent at 6 sigma against a ±50 percent tolerance[5] |
| Maximum paste height | — | 450 microns[5] |
| Optional dispensing | — | Automated solder paste dispensing as an optional add-on[5] |
| Warp compensation | — | Active warp compensation[5] |
| Technology | — | Patented 3D dual-inspection Moiré projection technology[5] |
| Illumination | — | IR-RGB LED dome styled illumination[6] |
| Operating system | — | Windows 10 IoT Enterprise LTSC 2019[6] |
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