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Comparison ledger

Flexus F 2320 I Stress MeasurementversusPM100

KLA Flexus F 2320 I Stress Measurement, MPI PM100, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMKLAMPI
CategoryTest & ProbeTest & Probe
Wafer size6"6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones1991 Vintage—
Control system——
Generation——
FamilyKLA Flexus F 2320 I Stress MeasurementMPI PM100
Specifications
ConfigurationDual Wavelength[1]—
Software Version2.0[1]—
Operating SystemMS-DOS V6.22[1]—
Voltage115V[1]—
Current10A[1]—
Wafer sizeThis system comes with an alignment/centering ring for a 6" wafer[1]—
Wafer Sizes6 inch, 8 inch[1]—
Vintage1991[1]—
MeasurementDual Wavelength[1]—
ManufacturerKLA[1]—
ModelFlexus F 2320 I[1]—
Wafer sizes6 in, 8 in[1]—
OpticsDual Wavelength[1]—
Alignment/centering ringIncludes an alignment/centering ring for a 6" wafer[1]—
8-inch wafer alignment toolDoes not have any alignment tool for an 8" wafer[1]—
Equipment—MPI TS150 Probe Station[2]
Use—Electrical testing on wafers or chips[2]
Terminal capacity—Maximum of 4 independent terminals + additional chuck grounding[2]
Wafer compatibility—Up to 6 inch wafers[2]
Probe positioners—MPI PM100 true X,Y,Z micro-positioners[2]
Probe tips—Interchangeable tungsten (W) contact tips[2]
Chuck stage—Fine-glide chuck stage on highly stable granite base[2]
Travel range—150 mm x 150 mm and 10 mm x 10 mm coarse and fine X-Y travel range[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]epfl.chepfl.ch