Comparison ledger
Lam Research 2300 Flex 45, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2300 Flex 45Lam Research | 110Tegal |
|---|---|---|
| OEM | Lam Research | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research 2300 | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Metal HP MWS[2] | — |
| 3 Chambers | Insulating Film / Metal / Ashing[2] | — |
| Make | Lam[2] | — |
| Model | 2300 Flex 45[2] | — |
| Equipment type | Etcher[2] | — |
| Chambers | 3 chambers[2] | — |
| Process coverage | Insulating film / Metal / Ashing[2] | — |
| Gases used for insulating film | C4F8, CF4, CH3F[2] | — |
| Gases used for metal | Cl2, BCl3[2] | — |
| Type | Etcher[2] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[4] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[4] |
| Physical description | — | compact[1] |
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