Comparison ledger
Lam Research 9600, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 9600Lam Research | 110Tegal |
|---|---|---|
| OEM | Lam Research | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research TCP 9600 | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Voltage | 208 V[2] | — |
| Configuration | Envision Software[2] | — |
| DSQ / Exit Load Lock | Heated paddle[3] | — |
| Wafer Size | 8 inch[2] | — |
| Software | Envision Software[2] | — |
| Load/Unload | Hine Cassette Indexer[2] | — |
| Entrance Load-lock | Present[2] | — |
| Remote AC Panel | Present[2] | — |
| Main Chamber Clamping | Bottom Actuated Clamping System[2] | — |
| Main Chamber Turbo Pump | Adixen Alcatel ATH 1300[2] | — |
| Main Chamber Valve | VAT 65[2] | — |
| Main Chamber Gas Configuration | 6 Gasses[2] | — |
| Main Chamber RF Generators | RPG 1250[2] | — |
| DSQ/Exit Load Lock Gas Configuration | 3 Gases[2] | — |
| DSQ/Exit Load Lock | WVDS, Heated Paddle, APM (Atmospheric Passivation Module)[2] | — |
| Manufacturer | Lam Research[4] | — |
| Model | 9600[2] | — |
| Category | Etch[4] | — |
| Load-lock | Entrance load-lock[2] | — |
| Turbo pump | Adixen Alacatel ATH 1300 turbo pump[2] | — |
| Valve | VAT 65[2] | — |
| Gas box | Configured for 6 gases[2] | — |
| RF generators | RPG 1250 RF generators[2] | — |
| DSQ / exit load lock | Configured for 3 gases[2] | — |
| DSQ / exit load lock options | WVDS, heated paddle, APM (Atmospheric Passivation Module)[2] | — |
| Power | 208 V[2] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[5] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[5] |
| Physical description | — | compact[1] |
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