Comparison ledger
Lam Research Alliance 6 9400 PTX, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Alliance 6 9400 PTXLam Research | 110Tegal |
|---|---|---|
| OEM | Lam Research | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research Alliance | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 3 Chamber[2] | — |
| Voltage | 208 VAC[3] | — |
| Full Load Current | 43 Amps[3] | — |
| Capacity of Main Breaker | 10 kA[3] | — |
| Wafer Size | 8 inch[2] | — |
| Number of Chambers | 3 Chamber[2] | — |
| Frequency | 50/60 Hz[3] | — |
| Operating System | Upgraded to Windows 7[3] | — |
| Endpoint Detection | OES (Optical Emission Spectroscopy)[3] | — |
| Chamber Type | Poly Etch Chambers[3] | — |
| Number of Poly Etch Chambers | All 3[3] | — |
| Vintage | 2000[3] | — |
| Asset # | 132832[4] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[5] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[5] |
| Physical description | — | compact[1] |
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