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Comparison ledger

AutoEtch 480versus1512e

Lam Research AutoEtch 480, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
AutoEtch 480Lam Research
1512eTegal
OEMLam ResearchTegal
CategoryEtchEtch
Wafer size——
Process nodePlasma etch—
Introduced1981—
Production run1981–—
Lifecycle——
Lifecycle milestones1981 Product introduction · 1982 First system sold · 1982 First sale—
Control system——
Generation——
FamilyLam Research AutoEtch 480Tegal 1512e
Specifications
Typeautomated polysilicon plasma etcher[1]—
Etch typePlasma etch (polysilicon)[1]—
Automation levelAutomated[1]—
ProcessPolysilicon plasma etch[1]—
AutomationAutomated[1]—
System typein-line, cassette-to-cassette, fully automated, single wafer, planar etching system[2]—
Process modesPPE-Planar Plasma Etching; RIE-Reactive Ion Etching (optional)[2]—
Throughput30-60 wafers/hour[2]—
Wafer size3 in., 100mm, or 125mm[2]—
Etch rategreater than 3,000 A/min[2]—
Uniformitybetter than ± 5% across wafer[2]—
RF power supply500 watts, automatically stabilized; 3.56 MHz, crystal controlled; 52 ohms output impedance[2]—
Facility power208 VAC, 3 phase, 5 wire, 20 amps, 50/60 Hz[2]—
Tool type—Industrial RIE plasma etcher system[3]
Stated configuration—With modules assembly for CI-4222[3]
Category—Etch[4]
Condition—Used[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]en.wikipedia.orgen.wikipedia.org
  2. [2]chiphistory.orgchiphistory.org
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]waferpedia.comwaferpedia.com
  5. [5]semistarcorp.comsemistarcorp.com