Comparison ledger
Lam Research SEZ 203 Spin, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SEZ 203 SpinLam Research | 110Tegal |
|---|---|---|
| OEM | Lam Research | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research SEZ | Tegal 110 |
| Cited variants |
| |
| Specifications | ||
| Software Version | 12.29.09.2000[2] | — |
| CIM | GEM[2] | — |
| Configuration | Process; Backside Clean[2] | — |
| Handler System | Robot[2] | — |
| Factory Interface | SMIF (2)[2] | — |
| Process | Cobalt Backside Clean[3] | — |
| Options System | UPS[3] | — |
| Wafer size | 8 inch (200mm)[2] | — |
| Vintage | 1998[3] | — |
| Wafer Handling | Bernoulli (chuck, grippers, handling)[4] | — |
| Open cassettes | 2[4] | — |
| Chemical cabinets (CDS) | 3[4] | — |
| System type | Spin Processing Wet System[5] | plasma etch system[7] |
| Make | Lam / SEZ[1] | — |
| Model | 203[1] | — |
| Wafer carrier | Two open cassettes[4] | — |
| Chemical cabinets | 3 chemical cabinets (CDS)[4] | — |
| Wafer handling | Bernoulli wafer handling[4] | — |
| Chuck | Bernoulli chuck[4] | — |
| Grippers | Bernoulli grippers[4] | — |
| Wafer Sizes | 8 inch[2] | — |
| Bernoulli wafer handling | Yes[4] | — |
| Bernoulli chuck | Yes[4] | — |
| Bernoulli grippers | Yes[4] | — |
| OEM | Lam / SEZ[1] | — |
| Equipment type | Spin Etcher[1] | — |
| Chemical Cabinets | 3 (CDS)[4] | — |
| Vintage year | 1998[3] | — |
| Wafer handling type | Bernoulli (chuck, grippers)[4] | — |
| model | — | 110 SE[6] |
| application focus | — | process development applications[6] |
| process capability | — | deep silicon plasma etching[6] |
| capabilities | — | very high aspect ratio trench etch and profile control[6] |
| configuration | — | multiple configurations with minimum technical intervention[6] |
| Supported components | — | MEMS and 3D-IC components[6] |
| Control capability | — | very high aspect ratio trench etch and profile control[7] |
| Physical description | — | compact[6] |
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