Comparison ledger
Laurell EDC-HL-23, Laurell EDC-HL-8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EDC-HL-23Laurell | EDC-HL-8Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 150mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 650-series | — |
| Family | Laurell EDC-HL-23 | Laurell EDC-HL-8 |
| Cited variants |
|
|
| Specifications | ||
| Process controller | 650-series process controller[1] | — |
| Wafer capacity | Up to 150 mm wafers[1] | Up to 200mm wafers[2] |
| Substrate capacity | Up to 5 in x 5 in (127 mm x 127 mm) substrates[1] | Up to 7" × 7" (178mm × 178mm) substrates[2] |
| Maximum rotation capability | 12,000 RPM with vacuum hold-down[1] | — |
| Recommended operating speed | 3,000 RPM with non-vacuum chucks[1] | 3,000 RPM and non-vacuum chucks[2] |
| Power | 95 to 240 VAC, 47/63 Hz, ~300 Watts[1] | 95 to 240 VAC, 47/63 HZ, ~300 Watts[2] |
| Nitrogen/CDA seal purge pressure | 60–70 PSIG (4–5 bar)[1] | — |
| Vacuum recommendation | 25–28 inches Hg with 4.5 SCFM at 0 inches Hg[1] | — |
| Model | EDC-HL-23[1] | — |
| OEM | Laurell Technologies[1] | — |
| Category | Spin Coater[1] | — |
| Series | 650-series EDC system[1] | 650-series EDC system[2] |
| Maximum speed capability | 12,000 RPM with vacuum hold-down[1] | 12,000 RPM with vacuum hold-down[2] |
| Recommended speed | 3,000 RPM[1] | 3,000 RPM with non-vacuum chucks[2] |
| Recommended chuck type | Non-vacuum chucks[1] | — |
| Supported processes | Etch, develop, clean[1] | — |
| Maximum wafer size | — | up to 200 mm[2] |
| Maximum substrate size | — | 7 in × 7 in (178 mm × 178 mm)[2] |
| Nitrogen/CDA pressure | — | 60–70 PSIG (4–5 bar)[2] |
| Vacuum requirement | — | 25–28 inches Hg; 4.5 SCFM at 0 inches Hg[2] |
| Product line | — | 650-series EDC Spin Processor[2] |
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