EDC-HL-23

The Laurell EDC-HL-23 B is an EDC spin processor. The Laurell EDC-HL-23 B is part of the 650-series EDC system family. The Laurell EDC-HL-23 B accommodates wafers up to 150 mm in diameter and substrates up to 5 in × 5 in (127 mm × 127 mm). The Laurell EDC-HL-23 B has a 12,000 RPM capability with vacuum hold-down, and the recommended configuration is 3,000 RPM with non-vacuum chucks.^[1][2]

A spin coater holds a wafer or other flat substrate on a chuck, dispenses process liquid onto the surface, and rotates the substrate so centrifugal flow and solvent evaporation form or condition a thin layer. Spin coaters typically combine a process chamber, a drive system, a substrate holder, and timed control of spin speed and process sequencing.

The Laurell EDC-HL-23 B supports etch, develop, and clean processes. The Laurell EDC-HL-23 B supports sequences typically followed by solvent or aqueous rinse and then dry.^[1][2]

The Laurell EDC-HL-23 B offers optional features for back side rinse, dynamic linear dispense, dynamic radial dispense, rinse to resistivity, heated process chemistry, level detection, leak detection, and dual containment plumbing. The Laurell EDC-HL-23 B also offers removable FEP Teflon process chamber liners, non-vacuum chucks and adapters, an integrated variable pneumatic vacuum generator, and optional Teflon housing for processes that require chemistry to be dispensed at elevated temperatures.^[1][2]