Laurell

EDC-HL-23

Spin coater 150mm650-seriesLaurell EDC-HL-23 family

Research Quality: 40% complete

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EDC-HL-23 — web.archive.org — Fig. 01EDC-HL-23web.archive.org^[1]

Wafer size

150mm

Power

95 to 240 VAC, 47/63 Hz, ~300 Watts^[1]

Vacuum

12,000 RPM with vacuum hold-down^[1]

What is it?

The EDC-HL-23 B is a Laurell EDC spin processor described as compact and equipped with a 650-series process controller. The source states it accommodates up to 150 mm wafers and 5 in x 5 in (127 mm x 127 mm) substrates, with a 12,000 RPM capability using vacuum hold-down but a recommendation for 3,000 RPM and non-vacuum chucks.

What can it run?

Process applications and technology nodes documented for this tool.

Etch
Develop
Clean
Rinse

What do the numbers mean?

Power & electrical1

Power: 95 to 240 VAC, 47/63 Hz, ~300 Watts^[1]

Vacuum & pumping4

Maximum rotation capability: 12,000 RPM with vacuum hold-down^[1]
Recommended operating speed: 3,000 RPM with non-vacuum chucks^[1]
Nitrogen/CDA seal purge pressure: 60–70 PSIG (4–5 bar)^[1]
Vacuum recommendation: 25–28 inches Hg with 4.5 SCFM at 0 inches Hg^[1]

Wafer handling2

Wafer capacity: Up to 150 mm wafers^[1]
Substrate capacity: Up to 5 in x 5 in (127 mm x 127 mm) substrates^[1]

Control & software1

Process controller: 650-series process controller^[1]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
EDC-HL-23 B	650-series	—	—	web.archive.org^[1]

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Maximum rotation capability12,000 RPM with vacuum hold-down^[1]
Recommended operating speed3,000 RPM with non-vacuum chucks^[1]
Power95 to 240 VAC, 47/63 Hz, ~300 Watts^[1]
Nitrogen/CDA seal purge pressure60–70 PSIG (4–5 bar)^[1]
Vacuum recommendation25–28 inches Hg with 4.5 SCFM at 0 inches Hg^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the EDC-HL-23 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EDC-HL-23 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the EDC-HL-23 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EDC-HL-23 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EDC-HL-23 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the EDC-HL-23 are on record.
Answerable by: an OEM parts catalog or a service engineer