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Laurell

EDC-HL-8

Spin coater200mmLaurell EDC-HL-8 family
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The Laurell EDC-HL-8 is a 650-series EDC Spin Processor. The Laurell EDC-HL-8 accommodates up to 200mm wafers and 7" × 7" substrates. The Laurell EDC-HL-8 has a 12,000 RPM capability with vacuum hold-down.[1][2]

EDC-HL-8 — web.archive.org
Fig. 01EDC-HL-8web.archive.org[1]

Wafer size

200mm

Power

95 to 240 VAC, 47/63 HZ, ~300 Watts[1]

Vacuum

12,000 RPM with vacuum hold-down[1]

What it is

The Laurell EDC-HL-8 B is an EDC spin processor. The Laurell EDC-HL-8 B is a 650-series EDC system. The Laurell EDC-HL-8 B will accommodate substrates up to 200 mm wafers and 7 inch by 7 inch substrates. The Laurell EDC-HL-8 B has a 12,000 RPM capability with vacuum hold-down, and the recommended configuration is 3,000 RPM with non-vacuum chucks.[1][2]

How it works

General reference — not yet source-verified

A spin coater holds a wafer or other flat substrate on a chuck while liquid chemistry is dispensed and centrifugal force drives the liquid across the surface. A spin coater shapes final film behavior through the interaction of dispense method, rotation, acceleration, time, and fluid properties. A spin coater usually operates inside an enclosed chamber that manages splashing, exhaust, drainage, and operator protection.

Where it fits in the process flow

The Laurell EDC-HL-8 B supports etch, develop, and clean processes. The Laurell EDC-HL-8 B supports sequences typically followed by solvent or aqueous rinse and then dry.[1][2]

Applications

The Laurell EDC-HL-8 B offers options for back side rinse, dynamic linear dispense, dynamic radial dispenser, rinse to resistivity, level detection, leak detection, heated process chemistry, and dual containment plumbing. The Laurell EDC-HL-8 B also offers removable FEP Teflon process chamber liners, in-deck mounting, on-deck mounting, a Teflon housing option, an integrated variable pneumatic vacuum generator, and wafer alignment tools.[1][2]

  • Etch
  • Develop
  • Clean
  • solvent or aqueous rinse

What do the numbers mean?

Power & electrical1

Power
95 to 240 VAC, 47/63 HZ, ~300 Watts[1]
Accurate?

Vacuum & pumping5

Maximum speed capability
12,000 RPM with vacuum hold-down[1]
Accurate?
Recommended speed
3,000 RPM with non-vacuum chucks[1]
Accurate?
Nitrogen/CDA pressure
60–70 PSIG (4–5 bar)[1]
Accurate?
Vacuum requirement
25–28 inches Hg; 4.5 SCFM at 0 inches Hg[1]
Accurate?
Recommended operating speed
3,000 RPM and non-vacuum chucks[1]
Accurate?

Wafer handling4

Maximum wafer size
up to 200 mm[1]
Accurate?
Maximum substrate size
7 in × 7 in (178 mm × 178 mm)[1]
Accurate?
Wafer capacity
Up to 200mm wafers[1]
Accurate?
Substrate capacity
Up to 7" × 7" (178mm × 178mm) substrates[1]
Accurate?

Configuration & options2

Series
650-series EDC system[1]
Accurate?
Product line
650-series EDC Spin Processor[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
EDC-HL-8 B——Described as the EDC-HL-8 B spin processor model; no other changes relative to a base model are stated in the source.web.archive.org[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Maximum speed capability12,000 RPM with vacuum hold-down[1]
  • Recommended speed3,000 RPM with non-vacuum chucks[1]
  • Power95 to 240 VAC, 47/63 HZ, ~300 Watts[1]
  • Nitrogen/CDA pressure60–70 PSIG (4–5 bar)[1]
  • Vacuum requirement25–28 inches Hg; 4.5 SCFM at 0 inches Hg[1]
  • Recommended operating speed3,000 RPM and non-vacuum chucks[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What substrate sizes does the EDC-HL-8 B accommodate?

The Laurell EDC-HL-8 B accommodates up to 200 mm wafers and 7 inch by 7 inch substrates.[1][2]

What spin speed capability and recommended operating configuration are given for the EDC-HL-8 B?

The Laurell EDC-HL-8 B has a 12,000 RPM capability with vacuum hold-down. The Laurell EDC-HL-8 B is recommended for only 3,000 RPM and non-vacuum chucks.[1][2]

Does the EDC-HL-8 B require a PC to run?

The Laurell EDC-HL-8 B can be used with Spin 3000 PC software, but a PC is not required to program or run the equipment.[1][2]

What process types are supported by the EDC-HL-8 B?

The Laurell EDC-HL-8 B supports etch, develop, and clean processes. The supported flow is typically followed by solvent or aqueous rinse and then dry.[1][2]

Not publicly documented

The following facts about the EDC-HL-8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EDC-HL-8 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the EDC-HL-8 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the EDC-HL-8 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the EDC-HL-8 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the EDC-HL-8 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]EDC-HL-8 Spin Coater - Laurell Technologies — images.laurell.comimages.laurell.com
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Last updated Oct 16, 2026.

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