Comparison ledger
Plasma-Therm SLR-770, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SLR-770Plasma-Therm | 110Tegal |
|---|---|---|
| OEM | Plasma-Therm | Tegal |
| Category | Etch | Etch |
| Wafer size | 2" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Plasma-Therm SLR 770 | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| System type | Shuttle lock ICP inductively coupled plasma etch system[2] | plasma etch system[4] |
| Controller | PC controller[2] | — |
| Load lock | Vacuum load lock with wafer transfer robot[2] | — |
| Wafer size capability | Can process wafers from 2" to 8" depending on which process kit is installed[2] | — |
| Current configuration | Currently configured with 3" kit[2] | — |
| Thermal transfer | Thermal transfer module for effective cooling of substrate utilizing helium backside thermal transfer in conjunction with computer controlled substrate clamping[2] | — |
| Plasma source | High frequency RF-based inductively coupled plasma source capable of high density plasma generation[2] | — |
| Pressure control | Closed loop pressure control[2] | — |
| Pumping | Turbo pump with roughing pump[2] | — |
| Gas controllers | Total of eight MFC gas controllers[2] | — |
| Previously used gases | N2, O2, CHF3, AR, CH4, CL2, BCL3, CF4[2] | — |
| Included accessory | Water chiller[2] | — |
| Etch application | Chlorine etching[2] | — |
| Listed gases | N2, O2, CHF3, Ar, CH4, Cl2, BCl3, CF4[2] | — |
| Wafer size | 2"[3] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[4] |
| Physical description | — | compact[1] |
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