Plasma-Therm
SLR-770
Plate 01Plasma-Therm SLR770 ICP Etcher Demonstration - System Overview - Part 1
Gregory WrightWatch on YouTubePlate 02Plasma-Therm SLR770 ICP Etcher Demonstration - Part 1
Gregory WrightWatch on YouTubePlate 03Plasma-Therm SLR770 ICP Etcher Demonstration - Part 2
Gregory WrightWatch on YouTubePlate 04Plasma-Therm SLR770 ICP Etcher Demonstration - Automatic Process Run
Gregory WrightWatch on YouTubePlate 05Plasma-Therm SLR770 ICP Etcher Demonstration - Part 3
Gregory WrightWatch on YouTubePlate 06Plasmatherm SLR-770 DRIE Bosch Process
ClassOneVideosWatch on YouTube
Wafer size
2"
Vacuum
Vacuum load lock with wafer transfer robot[1]
Gas delivery
Total of eight MFC gas controllers[1]
What it is
How it works
The system uses a high-frequency RF-based inductively coupled plasma source capable of high-density plasma generation. It includes closed-loop pressure control, a turbo pump with roughing pump, and a thermal transfer module for cooling the substrate with helium backside thermal transfer together with computer-controlled substrate clamping.[1]
The tool has a total of eight MFC gas controllers and includes a water chiller.[1]
Where it fits in the process flow
The system can process wafers from 2 inches to 8 inches depending on the installed process kit, and it is currently configured with a 3-inch kit.[1]
Applications
The listed gases used with the system are N2, O2, CHF3, Ar, CH4, Cl2, BCl3, and CF4.[1]
- Chlorine etching
What do the numbers mean?
Power & electrical1
- Plasma source
- High frequency RF-based inductively coupled plasma source capable of high density plasma generation[1]
Vacuum & pumping3
Wafer handling2
Gas & chemistry2
Control & software1
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Load lockVacuum load lock with wafer transfer robot[1]
- Plasma sourceHigh frequency RF-based inductively coupled plasma source capable of high density plasma generation[1]
- Pressure controlClosed loop pressure control[1]
- PumpingTurbo pump with roughing pump[1]
- Gas controllersTotal of eight MFC gas controllers[1]
- Previously used gasesN2, O2, CHF3, AR, CH4, CL2, BCL3, CF4[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the SLR-770 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SLR-770 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SLR-770 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SLR-770 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SLR-770 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SLR-770 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]nanolab.ucla.edu — nanolab.ucla.edunanolab.ucla.edu
Last updated Jul 29, 2026.
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