Plasma-Therm
SLR-770
The Plasma-Therm SLR-770 is a shuttle-lock ICP etch system for chlorine etching. The Plasma-Therm SLR-770 has a vacuum load lock with a wafer transfer robot. The Plasma-Therm SLR-770 can process wafers from 2 inches to 8 inches depending on the installed process kit.[1][2]
Plate 01Plasma-Therm SLR770 ICP Etcher Demonstration - System Overview - Part 1
Gregory WrightWatch on YouTubePlate 02Plasma-Therm SLR770 ICP Etcher Demonstration - Part 1
Gregory WrightWatch on YouTubePlate 03Plasma-Therm SLR770 ICP Etcher Demonstration - Part 2
Gregory WrightWatch on YouTubePlate 04Plasma-Therm SLR770 ICP Etcher Demonstration - Automatic Process Run
Gregory WrightWatch on YouTubePlate 05Plasma-Therm SLR770 ICP Etcher Demonstration - Part 3
Gregory WrightWatch on YouTubePlate 06Plasmatherm SLR-770 DRIE Bosch Process
ClassOneVideosWatch on YouTube
Wafer size
2"
Vacuum
Vacuum load lock with wafer transfer robot[1]
Gas delivery
Total of eight MFC gas controllers[1]
What it is
General reference — not yet source-verifiedPlasma etchers remove material from a wafer surface by exposing it to a low-pressure reactive discharge. ICP etchers are generally used when a process needs strong control of ion and radical generation for anisotropic or selective dry etching in microfabrication.
How it works
The Plasma-Therm SLR-770 uses a high-frequency RF-based inductively coupled plasma source capable of high-density plasma generation. The Plasma-Therm SLR-770 has closed-loop pressure control, a turbo pump with a roughing pump, and a thermal transfer module for substrate cooling that uses helium backside thermal transfer together with computer-controlled substrate clamping. The Plasma-Therm SLR-770 has a total of eight mass flow controller gas channels and includes a water chiller.[1]
Where it fits in the process flow
General reference — not yet source-verifiedPlasma etchers are used after pattern definition when a masking layer has already been formed on the wafer. Plasma etchers transfer that pattern into underlying films or substrates, and later process steps commonly include mask stripping, cleaning, metrology, deposition, or additional lithography depending on the device flow.
What can it run?
Process applications and technology nodes documented for this tool.
- Chlorine etching
Why won't it start?
Documented failure modes, common issues, and field considerations.
- One source states that the tool is currently configured with a 3-inch kit while another source lists the wafer size as 2 inches.
What do the numbers mean?
Power & electrical1
- Plasma source
- High frequency RF-based inductively coupled plasma source capable of high density plasma generation[1]
Vacuum & pumping3
Wafer handling4
Gas & chemistry3
Control & software1
Configuration & options5
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Load lockVacuum load lock with wafer transfer robot[1]
- Plasma sourceHigh frequency RF-based inductively coupled plasma source capable of high density plasma generation[1]
- Pressure controlClosed loop pressure control[1]
- PumpingTurbo pump with roughing pump[1]
- Gas controllersTotal of eight MFC gas controllers[1]
- Previously used gasesN2, O2, CHF3, AR, CH4, CL2, BCL3, CF4[1]
- Listed gasesN2, O2, CHF3, Ar, CH4, Cl2, BCl3, CF4[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Does the Plasma-Therm SLR-770 have a load lock and wafer transfer robot?
The Plasma-Therm SLR-770 has a vacuum load lock with a wafer transfer robot.[1]
Not publicly documented
The following facts about the SLR-770 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SLR-770 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SLR-770 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SLR-770 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the SLR-770 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SLR-770 are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]nanolab.ucla.edu — nanolab.ucla.edunanolab.ucla.edu
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 19, 2026.
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