Comparison ledger
SPTS RIE-10, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | RIE-10SPTS | 110Tegal |
|---|---|---|
| OEM | SPTS | Tegal |
| Category | Etch | Etch |
| Wafer size | 6-inch wafers | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SPTS RIE-10 | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Etch rate | 6–10 µm/min[2] | — |
| Aspect ratio | 50:1[2] | — |
| Selectivity to resist | >50:1[2] | — |
| Selectivity to silicon oxide | >100:1[2] | — |
| Uniformity | <5% across 6-inch wafers[2] | — |
| Primary RF power | up to 3,000 W[2] | — |
| Secondary RF power | up to 3,000 W[2] | — |
| Substrate power | up to 300 W[2] | — |
| Chuck temperature range | -15°C to +40°C[2] | — |
| Sample size handling | 6-inch or smaller samples[2] | — |
| End point detector | Claritas End Point Detector[2] | — |
| Wafer size | 6-inch wafers[3] | — |
| Tool type | deep silicon etching system[2] | — |
| Plasma sources | dual plasma sources[2] | — |
| Gas inlets | dual gas inlets[2] | — |
| Fixed RF matching | yes[2] | — |
| Dual plasma sources | yes[2] | — |
| Dual gas inlets | yes[2] | — |
| Side wall roughness (scallop depth) | <6 nm for nanoscale features; range 6–700 nm[2] | — |
| Wafer handling | 6-inch or smaller samples[2] | — |
| Endpoint detector | Claritas End Point Detector[2] | — |
| Side wall roughness | <6 nm for nanoscale features[2] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[4] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[4] |
| Physical description | — | compact[1] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →