Comparison ledger
SUSS MicroTec Delta 12 AQ, SUSS MicroTec Delta 80 Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Delta 12 AQSUSS MicroTec | Delta 80 SpinSUSS MicroTec |
|---|---|---|
| OEM | SUSS MicroTec | SUSS MicroTec |
| Category | Resist Processing | Resist Processing |
| Wafer size | Wafer Developing System Configuration | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec Delta | SUSS MicroTec Delta |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Software is not included[2] | Software is not included[4] |
| Maximum wafer diameter | 200 mm (8 in)[3] | — |
| Maximum substrate thickness | 5 mm[3] | — |
| Supported wafer diameters | 50 mm (2 in), 75 mm (3 in), 100 mm (4 in), 150 mm (6 in), 200 mm (8 in)[3] | — |
| Supported photomask sizes | 125 mm x 125 mm, 150 mm x 150 mm[3] | — |
| Supported developer chemistries | AZ400K, AZ300MIF, CD26[3] | — |
| Process type | temperature controlled spray photoresist development, cassette-to-cassette, dry in – dry out[3] | — |
| Operation control | Recipe controlled automated operation with precise temperature control[3] | — |
| Wafer size | Wafer Developing System Configuration | — |
| Vintage | 2009 | — |
| Coaters & Developers Vintage | 2009 | — |
| Development method | temperature controlled spray development[3] | — |
| Operation mode | cassette-to-cassette, recipe controlled[3] | — |
| Small pieces supported | No[3] | — |
| Phase | — | 3 Phase + N + PE[4] |
| Voltage | — | 400 V, 50 Hz[4] |
| Model | — | Delta 80[4] |
| Type | — | Spin Coater / Developer[4] |
| Technology | — | GYRSET closed cover coating technology[1] |
| Wafer capacity | — | wafers up to 8 in (200 mm)[1] |
| Substrate capacity | — | substrates up to 6 in x 6 in (150 x 150 mm)[1] |
| Process capability | — | delicate wafer fragments[1] |
| Operation | — | fully programmable process parameters[1] |
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