Comparison ledger
Tegal 110, Tegal 1511e, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 110Tegal | 1511eTegal |
|---|---|---|
| OEM | Tegal | Tegal |
| Category | Etch | Etch |
| Wafer size | — | three- to six-inch wafers |
| Process node | — | — |
| Introduced | — | 1984 |
| Production run | — | 1984– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 110 | Tegal 1511e |
| Cited variants |
| — |
| Specifications | ||
| model | 110 SE[1] | — |
| application focus | process development applications[1] | — |
| process capability | deep silicon plasma etching[1] | — |
| capabilities | very high aspect ratio trench etch and profile control[1] | — |
| configuration | multiple configurations with minimum technical intervention[1] | — |
| System type | plasma etch system[2] | — |
| Supported components | MEMS and 3D-IC components[1] | — |
| Control capability | very high aspect ratio trench etch and profile control[2] | — |
| Physical description | compact[1] | — |
| tool type | — | tri-electrode dual-frequency plasma etch system[3] |
| wafer size | — | three- to six-inch wafers[3] |
| first sold | — | 1984[3] |
| system characteristic | — | first vacuum-loadlocked dual-frequency tri-electrode etch system[3] |
| First vacuum-loadlocked dual-frequency tri-electrode etch system | — | Yes[3] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →