Waferpedia

Comparison ledger

110versus90 X

Tegal 110, Tegal 90 X, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
110Tegal
90 XTegal
OEMTegalTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2000 Debut sale
Control system——
Generation——
FamilyTegal 110Tegal 90 X
Cited variants—
Specifications
model110 SE[1]—
application focusprocess development applications[1]—
process capabilitydeep silicon plasma etching[1]—
capabilitiesvery high aspect ratio trench etch and profile control[1]—
configurationmultiple configurations with minimum technical intervention[1]—
System typeplasma etch system[2]—
Supported componentsMEMS and 3D-IC components[1]—
Control capabilityvery high aspect ratio trench etch and profile control[2]—
Physical descriptioncompact[1]—
Configuration—Dry Etch[3]
OEM—Tegal[3]
Model—90 X[3]
Tool type—Plasma Etcher[3]
Process type—Dry Etch[3]
Related description—non-critical etch tool[5]
etch type—Dry Etch[3]
platform—90X[5]
product family—i90X Series System[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org